A placement machine for electronic components

Abstract

The invention relates to a placement machine for electronic components, which is used for array placement of chip electronic components. The inlet bridge is installed on the platform of the machine body, and there is a guide rail in the suction head step bridge, and the affixed suction head is set at the left end of the guide rail in the suction head step bridge, and is controlled by a stepping motor; in the suction head step bridge The body platform below is provided with a guide rail that forms a cross with the suction head stepping bridge, and the mobile carrier is set at one end of the guide rail, and is controlled by a stepping motor; There is a vibration selection device, and the feeding position of the vibration selection device is vertically corresponding to the placement suction head. The invention has the advantages of reasonable structure, which can automatically select and arrange chip electronic components, provide better automatic detection conditions for component non-destructive testing equipment, and reduce missed and false detections.

Description

technical field [0001] The invention relates to a placement machine for electronic components, in particular to a fully automatic placement machine for array chip electronic components. Background technique [0002] In the production of electronic products, for the production of certain electronic products that need to be adapted to special working environments such as low temperature, high heat, and strong magnetic interference, there are higher requirements for the quality of the electronic components themselves during production, especially the internal components of chip capacitors. Whether the medium is damaged in the production, it is necessary to check the components by taking radiographs. Before the inspection, the arrangement of the components on the stainless steel plate is manually paved or arranged in a simple array, so that after the inspection of the equipment After the results are obtained, it is inconvenient to automate the screening, and the different densit...

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Problems solved by technology

[0002] In the production of electronic products, for the production of certain electronic products that need to be adapted to special working environments such as low temperature, high heat, and strong magnetic interference, there are higher requirements for the quality of the electronic components themselves during production, especially the internal components of chip capacitors. Whether the medium is damaged in the production, it is necessary to check the components by taking radiographs. Before the inspection, the arrangement of the components on the stainless steel plate is manually paved or arranged in a simple array, so that after the inspection of the equipment After the results are obtained, the automatic screening will bring inconvenience, and the density and formation of the inspection will cause missed detection and false detection.

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