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Device for detecting thermal contact resistance under micro-stress condition

A technology of contact thermal resistance and detection device, applied in the direction of thermal development of materials, can solve the problems of inability to realize the micro-stress contact thermal resistance, the effect of contact stress cannot be eliminated, etc., and achieve the effect of overcoming the influence of friction and accurate detection results.

Active Publication Date: 2014-11-05
HARBIN INST OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] In order to solve the problem that the traditional contact thermal resistance detection device can only detect the heat transfer of the tested part under relatively large stress, it cannot realize the contact thermal resistance under micro-stress or no stress state, and at the same time, there is a contact resistance caused by the self-weight of the material itself. The problem that stress cannot be eliminated, a contact thermal resistance detection device under micro-stress conditions is proposed

Method used

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  • Device for detecting thermal contact resistance under micro-stress condition
  • Device for detecting thermal contact resistance under micro-stress condition
  • Device for detecting thermal contact resistance under micro-stress condition

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specific Embodiment approach 1

[0020] Specific implementation mode 1. Combination Figure 1-Figure 4 Describe this specific embodiment. A contact thermal resistance detection device under micro-stress conditions described in this specific embodiment includes a vacuum cover 3, a cooling plate 6, a right fixed plate 9, a left fixed plate 19, a support frame 16, and a lifting platform 12 , heating plate 20, screw rod 21, spring 11, nut 22 and insulation plate 23, the inside of described vacuum cover 3 is a vacuum cavity, cooling plate 6, right fixed plate 9, left fixed plate 19, support frame 16, lifting platform 12. The heating plate 20, the screw rod 21 and the spring 11 are all located inside the vacuum chamber, the lift table 12 is fixed on the bottom of the vacuum cover 3, the top of the lift table 12 is placed to be tested, the right fixed plate 9 and the support frame 16 Located on both sides of the lifting platform 12, the right fixed plate 9 and the support frame 16 are all fixed on the bottom of the ...

specific Embodiment approach 2

[0023] Specific embodiment two, combine figure 1 Describe this specific embodiment. The difference between this specific embodiment and the contact thermal resistance detection device under micro-stress conditions described in the first specific embodiment is that it also includes a heat insulating element 17, and the heat insulating element 17 is fixed on the left Between the fixed plate 19 and the support frame 16.

[0024] In this embodiment, the left fixing plate 19 and the support frame 16 are separated by the heat insulating element 17, so that the heat in the heating plate 20 will not be transferred to the vacuum cover 3 through the support frame 16, so that the heat can be concentrated and the detection is improved. precision.

specific Embodiment approach 3

[0025] Specific embodiment three, combine figure 1 Describe this specific embodiment, the difference between this specific embodiment and the contact thermal resistance detection device under micro-stress conditions described in specific embodiment 1 is that it includes a backing plate, a vent pipe 9 and an air pump 8, and the backing plate is fixed On the top of the lifting platform 12, there is an air cavity inside the backing plate, and a plurality of through holes are opened on the top of the backing plate, and the plurality of through holes are all communicated with the air cavity. The air cavity inside the board communicates.

[0026] In this embodiment, when testing the contact thermal resistance of the tested piece, the air between the lifting table 12 and the tested piece is discharged by the air pump 8, thereby overcoming the influence of friction and making the testing result more accurate.

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Abstract

The invention discloses a device for detecting a thermal contact resistance under a micro-stress condition, relating to the technical field of detection on thermal contact resistances and solving the problems that a conventional device for detecting the thermal contact resistance is only used for detecting the heat transfer condition of a to-be-detected piece under relatively large stress but can not realize that the thermal contact resistance can be detected under micro-stress even a stress-free condition, and the contact stress generated by the dead load of a material can not be eliminated. According to the device disclosed by the invention, a left fixed plate and a right fixed plate are used for clamping the to-be-tested piece through matching of a lead screw and a nut; the elongation of a spring is controlled through the nut, and thus the micro-stress loading of the to-be-tested piece is realized; because scale lines are marked on the nut, the elongation of the lead screw can be determined, and further prestress among the to-be-tested pieces can be determined, the to-be-tested pieces are supported by a lifting platform; the left fixed plate and a support frame are separated by a thermal insulation element, so that heat in a heating plate can not be transmitted to a vacuum cover through the support frame, thus the heat can be concentrated, and the detection precision is improved. The device is suitable for detecting the thermal contact resistance.

Description

technical field [0001] The invention relates to the technical field of contact thermal resistance detection. Background technique [0002] The contact thermal resistance of the joint surface is one of the important characteristic parameters of the joint surface, and its accuracy will directly affect the characteristic model of the joint surface parameters. In high-precision optical systems such as lasers, the material will be deformed due to high contact stress, which will affect the optical accuracy. , so in this kind of optical system, there are widely micro-stress contact interfaces, and under different pre-tightening forces, it will greatly affect the heat transfer between materials. Contact thermal resistance plays a crucial role in the design calculations of optical components. The traditional measurement method can only detect the heat transfer of the tested part under relatively large stress, and cannot realize the contact thermal resistance under micro stress or no...

Claims

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Application Information

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IPC IPC(8): G01N25/20
Inventor 梁迎春孙付仲张鹏卢礼华
Owner HARBIN INST OF TECH