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Electronic device and air guide cover thereof

A technology of air guide cover and air guide plate, which is applied in the direction of electrical components, electrical digital data processing, digital processing power distribution, etc., and can solve problems such as unfavorable CPU heat dissipation and low impedance of the memory stick area

Inactive Publication Date: 2014-11-12
HONG FU JIN PRECISION IND (SHENZHEN) CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] In the existing server system, due to system structure restrictions or design requirements, many system CPUs (Central Processing Units) are designed to be placed on one flow channel. Due to the dense layout of components, it is difficult for the CPU to get additional airflow and heat dissipation from the front of the air outlet
In general, the impedance of the memory area of ​​the system is small, and a relatively large amount of traffic will flow away from the memory area, which is not conducive to CPU heat dissipation.

Method used

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  • Electronic device and air guide cover thereof
  • Electronic device and air guide cover thereof
  • Electronic device and air guide cover thereof

Examples

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Embodiment Construction

[0013] Please refer to figure 1 and figure 2 A preferred embodiment of the electronic device of the present invention includes a first heating element 30 installed on the mainboard 200, a second heating element 30a installed on the mainboard 200, a second heating element 30a installed on the mainboard 200 and located at the first heating element 30, the second The air guide cover 100 between the two heating elements 30 a and the memory modules 50 installed on the motherboard 200 and located on both sides of the first heating element 30 . In this embodiment, a fan (not shown in the figure) is disposed on the outside of the main board 200 adjacent to the first heating element 30 , and the air flow is blown from the first heating element 30 to the second heating element 30 a.

[0014] The wind deflector 100 includes a cover body 110 and two wind deflectors 120 pivotally disposed on two sides of the cover body 110 . The cover body 110 includes a top board 112 , and two side boa...

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Abstract

An electronic device includes a motherboard. A first heat sink and a second heat sink are set on the motherboard. A number of memories are set on the motherboard and located at two sides of the first heat sink. An air duct is located between the first heat sink and the second heat sink. The air duct includes a main body and two air baffles. The main body includes a top board and two side boards extending from opposite sides of the top board. The top board and the two side boards cooperatively define an airflow channel. The airflow channel includes an air intake facing the first heat sink, and an air outlet facing the second heat sink. Each side board defines an opening. Each air baffle is pivotably mounted to the corresponding side board and adjacent to the corresponding opening.

Description

technical field [0001] The invention relates to an electronic device and a wind guide cover thereof. Background technique [0002] In the existing server system, due to system structure restrictions or design requirements, many system CPUs (Central Processing Units) are designed to be placed on one flow channel. Due to the dense layout of components, it is difficult for the CPU to get additional airflow and heat dissipation from the front of the air outlet. In general, the memory area of ​​the system has a small impedance, and a relatively large amount of traffic will flow away from the memory area, which is not conducive to CPU heat dissipation. Contents of the invention [0003] In view of the above, it is necessary to provide an electronic device and an air guide cover that facilitates cooling of the CPU through the air outlet. [0004] A wind guide cover, including a cover body and a wind guide plate, the cover body includes a top plate and two side plates extending ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G06F1/18G06F1/20
CPCG06F1/20H05K7/20154H05K7/20727
Inventor 魏钊科张子轩
Owner HONG FU JIN PRECISION IND (SHENZHEN) CO LTD