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Plate carrier for improving oven heat convection effect

A technology of heat convection and board parts, applied in the direction of electrical components, printed circuit manufacturing, printed circuits, etc., can solve the problems of circuit pollution, circuit board pollution or damage, damage, etc., to improve yield, avoid pollution and damage damage effect

Inactive Publication Date: 2014-11-12
KINSUS INTERCONNECT TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] However, the disadvantage of the existing technology is that it is easy for personnel to touch the circuit board, resulting in endless problems of contamination or damage to the circuit board
This is because putting the circuit board into the storage box or removing the circuit board from the storage box is to pick and place or move the circuit board manually. The part with the circuit (that is, the invalid area), but in actual processing, it is inevitable that the area with the circuit (that is, the effective area) will be touched, causing the circuit to be polluted or damaged, and affecting the production yield of the circuit board

Method used

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  • Plate carrier for improving oven heat convection effect
  • Plate carrier for improving oven heat convection effect
  • Plate carrier for improving oven heat convection effect

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Embodiment Construction

[0039] The implementation of the present invention will be described in more detail in conjunction with the drawings and component symbols below, so that those skilled in the art can implement it after studying this specification.

[0040] refer to figure 1 , is a three-dimensional view of the plate carrier for improving the heat convection effect of the oven in the present invention. Such as figure 1 As shown, the plate carrier 1 of the present invention to improve the heat convection effect of the oven is mainly used to support a plate 3 with a thickness of less than 40 μm, wherein the plate 3 can be a circuit board, a thin plate or other suitable plates, wherein the thin plate The thickness is less than 40μm. The plate carrier 1 for improving the heat convection effect of the oven includes a main frame 10 and at least one support bar 20, and the material of the main frame 10 and the at least one support bar 20 is made of acid and alkali resistant materials such as carbon ...

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Abstract

A plate carrier for improving oven heat convection effect, used for carrying a plate, comprises main frames and at least one support strip, the main frames include four side frames surrounding a hollow area, the at least one support strip crosses the hollow area to support the plate, the at least one support strip has radian, and the support strip with the radian supports the plate by the arc top portion and is spaced with the plate in the main frames over or below the support strip, so as to prevent the plate from being damaged or polluted due to mutual contact. The invention provides a design that broken vacuum is maintained between the plate carrier and the plate so that a mechanical arm can move the plate carrier, so that the plate carrier and the plate can be transferred and transmitted automatically, and the plate can be totally prevented from being polluted by people, thereby facilitating improving yield; and in addition, the top surface or the bottom surface of at least two opposite side frames is of a non-planar structure so as to improve the oven heat convection effect.

Description

technical field [0001] A board carrier, especially a board carrier that can complete automatic transfer with a machine throughout the whole process, wherein the boards of the board carrier are also automatically transferred through the machine, and at least two opposite side frames The top surface or the bottom surface is a non-planar structure, which can improve the heat convection effect of the oven. Background technique [0002] With the trend of thinner and smaller electrical products, the traditional thick circuit boards (rigid circuit boards) no longer meet the thickness specifications, making the development of thin boards with a thickness less than 40 μm gradually becoming the mainstream. As far as the prior art is concerned, the manufacturing process of the circuit board includes steps such as electroplating, etching, water washing, drying and drying. After the circuit boards are dried or dried, the circuit boards will be placed in the circuit board temporary stora...

Claims

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Application Information

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IPC IPC(8): H05K3/00
Inventor 叶佐鸿蔡东明陈昱安陈亚祥
Owner KINSUS INTERCONNECT TECH
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