Composition and application of a two-phase contaminant removal medium
A technology of contaminants and intermetallic dielectrics, which can be used in cleaning methods and utensils, preparation of detergent mixture compositions, detergent compositions, etc., and can solve problems such as difficulties
Inactive Publication Date: 2014-11-19
LAM RES CORP
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Problems solved by technology
Removing such small particulate contaminants without adversely affecting surfaces and features on the substrate can be very difficult
Method used
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[0026] Several exemplary embodiments of improved substrate cleaning techniques for removing particulate contamination from substrates to increase process efficiency are provided. It should be understood that the present invention can be implemented in various forms including, for example, a solution, a process, a method, an apparatus or a system. Some inventive embodiments of the invention are described below. It will be apparent to one skilled in the art that the present invention may be practiced without some or all of the specific details set forth herein.
[0027] The substrate cleaning technique utilizes a cleaning material with a solid component and a polymer having a large molecular weight dispersed in a cleaning liquid to form the cleaning material (or cleaning solution or cleaning agent). The solid components remove contaminants from the surface of the substrate by contacting the contaminants. Polymers with large molecular weights form polymer chains and polymer net...
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The embodiments provide substrate cleaning techniques to remove contaminants from the substrate surface to improve device yield. The substrate cleaning techniques utilize a cleaning material with solid components and polymers with a large molecular weight dispersed in a cleaning liquid to form the cleaning material, which is fluidic. The solid components remove contaminants on the substrate surface by making contact with the contaminants. The polymers with large molecular weight form polymer chains and a polymeric network that capture and entrap solids in the cleaning materials, which prevent solids from falling on the substrate surface. In addition, the polymers can also assist in removing contaminants form the substrate surface by making contacts with contaminants on the substrate surface. In one embodiment, the cleaning material glides around protruding features on the substrate surface without making a forceful impact on the protruding features to damage them. The present invention can be implemented in numerous ways, including a material (or solution), a method, a process, an apparatus, or a system.
Description
[0001] This application is a divisional application of the invention patent application with the application number 200980144364.4, the application date is October 1, 2009, and the applicant is Rum Research Company, which is named "composition and application of two-phase pollutant removal medium". . technical field [0002] In the manufacture of semiconductor devices (eg, integrated circuits, memory cells, etc.), a series of fabrication steps are used to define features on a semiconductor substrate ("substrate"). During the series of manufacturing processes, the substrate surface is exposed to various types of contaminants. Basically, any material present in the manufacturing process is a potential source of contamination. For example, sources of contamination may include process gases, chemicals, deposition materials, etch by-products, liquids, and the like. Various contaminants may deposit on the wafer surface in particulate form (or particles). Background technique ...
Claims
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IPC IPC(8): B08B3/08C11D3/37C11D3/20C11D3/43C11D7/32C11D7/26C11D7/50
CPCC11D3/222C11D3/43C11D3/3723C11D3/378C11D3/37C11D17/0013C11D3/3765C11D3/2079Y10S134/902C11D7/5004C11D17/003C11D7/265C11D7/268C11D3/3753C11D11/0047C11D3/3773C11D3/3707B08B3/02C11D2111/22B08B3/08C11D3/20H01L21/306
Inventor 朱极阿琼·门迪拉塔大为·穆易
Owner LAM RES CORP