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A pedestal and countersinking technology, applied in electrical components, semiconductor/solid-state device manufacturing, circuits, etc., can solve the problems of turbulent gas flow, much useless space, insufficient number of substrates, etc., to achieve the effect of efficiency

Active Publication Date: 2016-12-14
TOYO TANSO KK
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, in such a concentric spot facing arrangement, there is a lot of useless space, so the number of substrates that can be coated in one process is not sufficient, and the efficiency of the process is poor.
[0003] Moreover, if there are many free parts not covered by the substrate on the surface of the susceptor main body, it acts as a resistance to the flow of the gas blown on the surface of the susceptor main body, so the flow of the gas is disturbed and becomes an obstacle. The main reason for the uniform growth of the thickness of each substrate will lead to a decrease in quality, resulting in a decrease in yield

Method used

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Embodiment approach 1

[0032] Hereinafter, the present invention will be described in detail based on embodiments. In addition, this invention is not limited to the following embodiment.

[0033] The vapor phase growth apparatus used in the production of epitaxial wafers is, for example, a vertical vapor phase growth apparatus called a micro-batch furnace capable of epitaxially growing a plurality of semiconductor wafers at the same time. This vertical vapor phase growth apparatus includes a box-shaped chamber, a susceptor capable of placing a plurality of wafers approximately horizontally, a source gas supply mechanism for supplying a source gas into the chamber, and a mechanism for supplying a carrier gas into the chamber. A carrier gas supply mechanism and a heating mechanism for heating the inside of the chamber. The base of the present invention located on the device is as figure 1 shown.

[0034] figure 1 is a plan view of the base of the present invention. The base 1 is disc-shaped. A p...

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Abstract

The present invention provides a base that changes the spot facing arrangement of the outermost spot facing row arranged on the outer periphery of a plurality of spot facing rows arranged in the closest packing arrangement of a honeycomb pattern structure. The outer peripheral part is equipped with as many spot facing holes as possible to eliminate useless space. Among the concentric hexagonal spot facing rows (A1, A2) of the honeycomb pattern structure, the spot facing at each vertex of the second outermost spot facing row (A2) and the spot facing of the outermost peripheral spot facing row (A3) The two spot facing holes are each substantially in point contact, and the two spot facing holes are substantially in point contact with each other. Between the spot facing (M(3)‑C) and the spot facing (M(3)‑B) of the outermost spot facing row (A3) are placed the vertices (B2) and vertices in the spot facing row (A2) The number of spot facings arranged between (B1) is the same number of spot facings, between the spot facing (M(3)‑D) and the spot facing (M(3)‑E) of the outermost spot facing row (A3) The same number of countersinks as the number of countersinks arranged between the vertex (B2) and the vertex (B3) of the countersink row (A2) are disposed between them.

Description

technical field [0001] The present invention relates to a susceptor used in the manufacture of semiconductor devices and the like, and relates to a susceptor having a close-packed arrangement structure in which a maximum number of spot facing holes are arranged on the surface of the susceptor. Background technique [0002] For example, a susceptor used for compound growth on a sapphire substrate in a manufacturing process of an LED chip or epitaxial growth of Si on a Si wafer substrate in a manufacturing process of a Si device has a spot facing hole for mounting each wafer. The spot facing arrangement of the above-mentioned base is often arranged concentrically. However, in such a concentric spot facing arrangement, there are many useless spaces, so the number of substrates that can be coated in one process is insufficient, and the efficiency of the process is poor. [0003] Moreover, if there are many free parts not covered by the substrate on the surface of the susceptor ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/683
CPCH01L21/68785H01L21/68771
Inventor 佐佐木清秀
Owner TOYO TANSO KK