Automatic solder paste printing machine

Abstract

The invention discloses a fully automatic solder paste printing machine, which comprises a frame part, a Z-axis lifting system is installed at the bottom of the frame part, a platform correction system is installed on the top of the Z-axis lifting system, and a platform correction system is installed on the platform correction system. There is a guide rail transportation system; the frame is equipped with a steel mesh frame clamping system, a scraper printing system and an automatic cleaning system; the Z-axis lifting system makes the lifting movement stable, and the positioning is fast and accurate, which solves the lifting control positioning with large inertia The problem of low precision and slow response speed; the platform calibration system solves the problem of inaccurate manual PCB calibration and improves the printing quality; the cleaning of the stencil frame adopts any combination of dry cleaning, wet cleaning and vacuum cleaning. The cleaning effect of the steel screen frame is greatly improved, which saves manual cleaning time and reduces labor intensity; the squeegee printing system can accurately control and adjust the pressure of the squeegee, which solves the problem that the squeegee pressure of the traditional printing machine cannot be controlled.

Description

technical field [0001] The invention relates to the technical field of circuit board manufacturing, in particular to an automatic solder paste printing machine. Background technique [0002] The application of electronic products has penetrated into all aspects of life, and people's requirements for the manufacture of electronic products are getting higher and higher, because electronic products are becoming smaller and more sophisticated, and the PCB production of electronic products must be completed by SMT equipment. The solder paste printing in the first process is done by the solder paste printing machine, so the processing of the first process largely determines the production quality of PCB. At present, in the known field, semi-automatic solder paste printing machines are mostly used for PCB solder paste printing. The printing needs to be manually corrected and aligned, and the stencil frame is completely cleaned manually. The production efficiency is low and automati...

AI Technical Summary

Problems solved by technology

At present, in the known field, semi-automatic solder paste printing machines are mostly used for PCB solder paste printing. The printing needs to be manually corrected and aligned, and the stencil frame is completely cleaned manually. The production efficiency is low and cannot be automated.

[0003]The traditional semi-automatic solder paste printing machine has the following disadvantages: the lifting system is driven by air pressure, the operation is unstable, and the positioning accuracy is poor; the circuit board and the stencil frame are manually corrected Alignment, the alignment accuracy is low, and it is time-consuming and laborious; the cleaning of the steel mesh frame is completely manual cleaning, the cleaning effect is not good and the labor intensity is increased; the pressure of the scraper cannot be adjusted

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