Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Intelligent card tower type chip writing device and chip writing method

A smart card and chip technology, applied in the direction of cooperative operation devices, record carriers used by machines, instruments, etc., can solve the problems of poor production flexibility and high equipment cost, and achieve the effects of increased production flexibility, reduced equipment cost, and shortened travel time

Active Publication Date: 2014-12-10
GUANGZHOU MINGSEN TECH CO LTD
View PDF3 Cites 11 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] In the existing tower-type chip writing device, for the contact smart card and the contactless smart card, it is necessary to use the contact tower-type chip writing device and the non-contact tower-type chip device to realize the chip writing work, and the two kinds of writing cannot be combined. The chip method is integrated on a set of chip writing devices, which has disadvantages such as poor production flexibility and high equipment costs.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Intelligent card tower type chip writing device and chip writing method
  • Intelligent card tower type chip writing device and chip writing method
  • Intelligent card tower type chip writing device and chip writing method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0043] see Figure 1 to Figure 8 , the smart card tower-type writing chip device of the present invention includes a tower-type writing chip assembly and a driving mechanism 7 that drives the tower-type writing chip assembly to move vertically, and the tower-type writing chip assembly includes 10 writing chips arranged vertically Units 40 , each chip writing unit 40 is provided with a card slot 2 for accommodating a card 1 . Each writing chip unit 40 is provided with a contact writing chip assembly, and 5 are also provided with a non-contact writing chip assembly, wherein the non-contact writing chip assembly is arranged alternately among the 10 writing chip units 40 and is located at the top The writing chip unit 40 is provided with a non-contact writing chip assembly; that is: every other writing chip unit 40 is provided with a writing chip unit 40 provided with a non-contact writing chip assembly, which is conducive to pulling apart two non-contact writing chip units. The ...

Embodiment 2

[0070] The difference between this embodiment and Embodiment 1 is that in this embodiment, each of the writing chip units is provided with a non-contact writing chip assembly.

[0071] Embodiments other than the above in this embodiment are the same as in Embodiment 1.

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses an intelligent card tower type chip writing device and a chip writing method. The chip writing device comprises a tower type chip writing module and a driving mechanism driving the tower type chip writing module to move in the vertical direction, wherein the tower type chip writing module comprises multiple chip writing units arranged in the vertical direction. A contact type chip writing module is arranged on each chip writing unit, non-contact type chip writing modules are further arranged on a part or all of chip writing units, the contact type chip writing modules comprise probes and contact type card readers, and the non-contact type chip writing modules comprise antenna plates and non-contact type card readers. Probe connecting mechanism for lifting up and putting down the probes are connected onto the probes, and a shielding layer made of a wave-absorbing material is arranged between every two adjacent chip writing units provided with the non-contact type chip writing modules. The chip writing device can perform chip writing on contact type smart cards and can also perform chip writing on non-contact type smart cards.

Description

technical field [0001] The invention relates to production equipment for smart cards, in particular to a smart card tower type chip writing device and a chip writing method. Background technique [0002] Smart cards are divided into contact smart cards, non-contact smart cards and dual-interface cards according to the access method of the chip. Among them, contact smart cards need to be accessed through contacts in contact with the chip, contactless smart cards are accessed through radio frequency, and dual-interface cards It is a smart card that integrates contact and non-contact interfaces. It has two operation interfaces. The access to the chip can be through the contacts of the contact method, or the chip can be accessed by radio frequency through a certain distance. Correspondingly, in the process of producing a smart card, when writing information on a chip (called writing a chip), it is also divided into a contact method and a non-contact method of writing a chip. ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): G06K19/07G06K17/00
Inventor 王开来吴伟文房训军赖汉进黄文豪陈伟
Owner GUANGZHOU MINGSEN TECH CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products