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heat-expandable formulations

A technology of thermal expansion and preparation, which is applied in the field of thermal expandable preparations, and can solve the problems of insufficient anti-sag and non-sag properties

Active Publication Date: 2017-02-08
HENKEL KGAA
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, these have the disadvantage of insufficient non-sag resistance, especially when they are applied in relatively large film thicknesses
Additionally, these pasty structural adhesives tend to bleed from the intended application area during heating and therefore do not achieve their full effectiveness at the desired site

Method used

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Examples

Experimental program
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Embodiment

[0165] 1 Preparation of formulations

[0166] The following thermally expandable formulations were prepared.

[0167] Quantitative data are expressed in percent by weight unless otherwise stated.

[0168] Table 1:

[0169]

[0170] In addition, the following thermally expandable formulations of the present invention additionally containing a flame retardant were prepared:

[0171]

[0172] 2. List of goods used

[0173] VS5500 hollow glass spheres; manufacturer 3M; density 0.38g / cm 3

[0174] QR-9466 Modified polyurethane resin; manufacturer is Adeka

[0175] TS-720 Silica, fumed amorphous silica, manufactured by Cabot

[0176] 331 Reaction product of bisphenol A and epichlorohydrin; EEW is about 187g / eq; viscosity at 25°C is 12.5Pa*s; manufacturer is Dow

[0177] 732 reaction product of epichlorohydrin and polypropylene glycol; EEW is about 320g / eq; viscosity at 25°C is 0.034Pa*s; manufacturer is Dow

[0178] 736 reaction product of epichlorohydrin a...

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Abstract

The subject of the present application is a heat-expandable formulation pumpable at an application temperature below 70° C., containing: (a) at least one first epoxy resin E1, the epoxy resin of said first epoxy resin E1 an equivalent weight of at most 280 g / eq and a viscosity at 25° C. of at most 1250 Pa*s, (b) at least one second epoxy resin E2 having an epoxy equivalent weight of at least 300 g / eq, and a viscosity at 25° C. of at most 250 Pa*s, (c) at least one heat-activatable curing agent, (d) at least one heat-activatable propellant, and (e) at least 1% by weight of organic fibers, The fiber length of the organic fibers is 0.2 mm to 10 mm at the application temperature.

Description

technical field [0001] The present application relates to heat-expandable formulations pumpable at application temperatures below 70°C, containing specific epoxy resins, heat-activatable hardeners, heat-activatable blowing agents and specifically selected organic Combinations of fibers, methods of reinforcing components with thin-walled structures using such formulations, and the use of such formulations for reinforcing structures of this type. Background technique [0002] Many fields of application require the mass production of lightweight components that are consistently dimensionally stable and have high stiffness and high structural strength. In particular, in automobile manufacturing, due to the need for weight reduction in this industry, there is a high demand for lightweight components made of thin-walled structures but still possessing sufficient stiffness and structural strength. One way to achieve both high stiffness and structural strength while achieving the l...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08K7/02C08G59/22C08G59/38
CPCC08G59/226C08G59/38C08K7/02C08G59/36C08L63/00C08L2205/02C08J2207/00C08J2477/10C08J9/0028C08J9/0061C08J9/32C08J2203/22C08J2463/00C08K3/013Y10T428/1376C08J9/0066C08J9/0085C08J2363/00
Inventor E·巴里奥M·伦克尔R·舍恩菲尔德S·武赫尔芬尼希T·韦尔特斯
Owner HENKEL KGAA
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