Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Core-level dynamic voltage and frequency scaling in a chip multiprocessor

A processor core, multi-processor technology, used in electrical digital data processing, digital data processing components, instruments, etc.

Inactive Publication Date: 2014-12-10
EMPIRE TECH DEV LLC
View PDF8 Cites 7 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, simply adding more transistors to a single-threaded processor no longer produces a significantly faster processor

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Core-level dynamic voltage and frequency scaling in a chip multiprocessor
  • Core-level dynamic voltage and frequency scaling in a chip multiprocessor
  • Core-level dynamic voltage and frequency scaling in a chip multiprocessor

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0014] In the following detailed description, reference is made to the accompanying drawings which form a part hereof. In the drawings, similar symbols typically identify similar components, unless context dictates otherwise. The illustrative embodiments described in the detailed description, drawings, and claims are not meant to be limiting. Other embodiments may be utilized, and other changes may be made, without departing from the spirit or scope of the subject matter presented here. It will be readily understood that aspects of the disclosure, as generally described herein and illustrated in the drawings, can be arranged, substituted, combined and designed in a wide variety of different configurations, all of which are are expressly contemplated and form part of this disclosure.

[0015] Semiconductor chip fabrication often includes a sequence of photographic and chemical processing steps during which electronic devices and circuits are progressively created on wafers ma...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

Techniques described herein generally include methods and systems related to manufacturing a chip multiprocessor having multiple processor cores. An example method may include receiving performance or reliability information associated with each of the multiple processor cores, wherein the received performance or reliability information is determined prior to packaging of the chip multiprocessor, and storing the received performance or reliability information such that stored performance or reliability information is used to adjust an operating parameter of at least one of the multiple processor cores of the chip multiprocessor.

Description

Background technique [0001] Unless otherwise indicated herein, the approaches described in this section are not prior art to the claims in this application and are not admitted to be prior art by inclusion in this section. [0002] Consistent with Moore's Law, the number of transistors that can feasibly be incorporated into an integrated circuit doubles approximately every two years. This trend has been going on for half a century and is expected to continue until at least 2015 or 2020. However, simply adding more transistors to a single-threaded processor no longer produces a significantly faster processor. Alternatively, increased system performance has been achieved by integrating multiple processor cores on a single chip to create a chip multiprocessor and sharing processes among the multiple processor cores of the chip multiprocessor. In addition, multiple processor cores of a chip processor can share other common system components, which can facilitate a lower cost and...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): G06F15/76
CPCG06F9/4405G06F1/3296G06F1/324G06F1/3243Y02D10/00
Inventor E·克鲁格里克
Owner EMPIRE TECH DEV LLC
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products