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Glass substrate cutting and carrying device and cutting system

A glass substrate and carrying device technology, applied in glass cutting devices, glass manufacturing equipment, manufacturing tools, etc., can solve problems such as bumping glass substrates and display panel defects, and achieve the effect of ensuring product yield

Active Publication Date: 2018-03-27
TCL CHINA STAR OPTOELECTRONICS TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] like figure 1 As shown, the glass substrate is placed on the carrier platform composed of the upstream station 2 and the downstream station 3, the glass substrate is separated from the position of the cutting line, and a step is formed at the cutting position of the left glass substrate 4 When the downstream station 3 moves away from the upstream station 2 and drives the right glass substrate 6 to translate, because the height of the downstream station 3 is lower than that of the upstream station 2 height, the glass substrate 6 will scratch the end 5 of the glass substrate 4, resulting in defective display panels

Method used

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  • Glass substrate cutting and carrying device and cutting system
  • Glass substrate cutting and carrying device and cutting system

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Embodiment Construction

[0016] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present invention.

[0017] see figure 2 , The best embodiment of the present invention provides a glass substrate cutting carrier, which includes an upstream carrier 10 , a downstream carrier 15 , an auxiliary carrier 20 and a moving support 25 . The upstream carrier table 10 and the downstream carrier table 12 jointly carry the glass substrate 30 to be cut, the downstream carrier table 15 and the auxiliary carrier table 20 are installed on the mobile support 25, and the auxiliary ca...

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Abstract

The present invention provides a glass substrate cutting and supporting device. The glass substrate cutting and supporting device includes an upstream supporting platform, a downstream supporting platform adjacent to the upper supporting platform, an auxiliary supporting platform and a moving support. The upstream supporting platform . The auxiliary carrier and the downstream carrier jointly carry the glass substrate to be cut, the downstream carrier and the auxiliary carrier are mounted on the mobile support, and the auxiliary carrier is located between the upstream carrier and the downstream carrier It is also connected with a lifting drive, which adjusts the height of the auxiliary carrier table relative to the upstream carrier table. After the glass substrate is cut, the auxiliary carrier table rises to the height of the upper upstream carrier table to reach the height after cutting. glass substrate, and drive the downstream carrier and auxiliary carrier away from the upstream carrier by moving the bracket.

Description

technical field [0001] The invention relates to the field of liquid crystal panels, in particular to a glass substrate cutting carrier device and a cutting system. Background technique [0002] The general structure of the existing glass substrate includes: a TFT substrate and a CF substrate laminated up and down, and liquid crystal molecules poured between the TFT substrate and the CF substrate. The prepared glass substrates are then cut and separated according to the size of different displays. The existing cutting technology is to use an upper cutter head and a lower cutter head to respectively cut the TFT substrate and the CF substrate at the gap between the upstream suction table and the downstream suction table. [0003] Such as figure 1 As shown, the glass substrate is placed on the carrier platform composed of the upstream station 2 and the downstream station 3, the glass substrate is separated from the position of the cutting line, and a step is formed at the cutt...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C03B33/02
Inventor 邓鸿韬
Owner TCL CHINA STAR OPTOELECTRONICS TECH CO LTD