An in-line led lamp bead package structure

Abstract

The invention belongs to the technical field of LED lamp beads, and specifically provides a direct inserting type packaging structure for an LED lamp bead. The direct inserting type packaging structure of the LED lamp bead comprises a plurality of lamp beads and a die set lamp bar; the lamp beads are inserted to the die set lamp bar, wherein the lamp beads are integrally equipped with a radiating structure and are connected with the die set lamp bars through a male and female inserting structure, and therefore, the inserting is convenient. With the adoption of the direct inserting type packaging structure for the LED lamp bead, the heat can be transferred without any barrier; the whole lamp bead bodies are radiating bodies, and therefore, the radiating area is effectively expanded; in addition, the radiating path is optimized, the junction temperature of a chip is lowered down, both the service life and lighting effect of the chip are greatly prolonged and raised; furthermore, the male and female inserting structure is further used, thus the lamp beads can be conveniently dismounted and simply repaired.

Description

technical field [0001] The invention belongs to the technical field of LED lamp beads, in particular to an in-line LED lamp bead packaging structure. Background technique [0002] Due to the complex structure and process of high-power LED packaging, which directly affects the performance and life of LEDs, it has been a research hotspot in recent years, especially high-power white LED packaging is a hot spot among the research hotspots. The functions of LED packaging mainly include the following three points: one is mechanical protection to improve reliability; the other is to strengthen heat dissipation to reduce chip junction temperature and improve LED performance; the third is optical control to improve light output efficiency and optimize beam distribution. The future development trend is to form a universal and standardized independent light source through the packaging process, and it is suitable for different LED lamps. [0003] The selection of LED packaging method,...

AI Technical Summary

Problems solved by technology

[0004] However, there are currently two key technical problems in the packaging of high-power LEDs: one is the high thermal resistance packaging process; the other is that the packaging structure and process have a greater impact on the light extraction rate

[0007] At present, LED downlights are composed of radiators, aluminum substrates, lamp beads, PC covers, and power supplies. Their use has great limitations. There are three main reasons: First, the LED light source is directly welded on the aluminum substrate, and the aluminum substrate is fixed on the On the downlight radiator, the customer cannot adjust the brightness by himself. If there is no light, and the customer cannot repair it by himself, the light source and power supply need to be replaced. Poor, and the light efficiency and power per unit area are low, which cannot meet the requirements of LED devices

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