Method and device for universally and continuously die-stamping FPC (Flexible Printed Circuit) auxiliary material

Abstract

The invention relates to a method and a device for universally and continuously die-stamping a FPC (Flexible Printed Circuit) auxiliary material. A punching mechanism in the device is divided into an upper mould and a lower mould, wherein the upper mould comprises an upper mould seat, an upper clamping plate and an upper template, and the upper mould seat, the upper clamping plate and the upper template are fixedly connected through bolts; the lower mould comprises a lower template, a lower mould seat and a clamping seat, and the lower template and the lower mould seat are respectively and fixedly arranged on the clamping seat through bolts. By effectively combining a feeding mechanism comprising a fixed clamping device and a movable clamping device with a universal die-punching mechanism and a cutting mechanism, inputting required dimension data into a controller display and controlling a punching machine at intervals to adjust the shape size of the stamped auxiliary material, not only is the transformation from original manual punching to continuous automatic punching realized, but also the die-cutting range and magnitude of a mould can be flexibly adjusted, the molding mould-opening quantity of the FPC auxiliary material and the machining working procedure of the auxiliary material are decreased, the production cost is lowered, and the production efficiency is improved.

Description

technical field [0001] The invention relates to the field of processing and manufacturing parts of mobile phones and computer / digital products, in particular to a universal continuous die-punching method and device for auxiliary materials of flexible circuit boards. Background technique [0002] With the continuous development and progress of science and technology, the requirements for circuit boards are getting higher and higher, especially for digital products that pursue convenience and light weight. Flexible circuit boards with scrambling, ultra-thin, and light weight are used as high-tech products in The electronic field has been greatly developed and applied. At the same time, the requirements for its performance are gradually increasing. However, in today's rapid development of automation, the auxiliary materials of flexible circuit boards still use traditional production processes: cutting into sheets, wrapping boards, Drilling, manual punching, high production cost...

AI Technical Summary

Problems solved by technology

[0002] With the continuous development and progress of science and technology, the requirements for circuit boards are getting higher and higher, especially digital products pursue convenience and light weight. Flexible circuit boards with scrambling, ultra-thin and light weight are used as high-tech products in The field of electronics has been greatly developed and applied, and at the same time, the requirements for its performance are gradually increasing. However, in today's rapid development of automation, the punching of auxiliary materials for flexible circuit boards still adopts traditional production processes: cutting into sheets, wrapping boards, Drilling, manual punching, high production cost and low efficiency

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