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High heat conduction apparatus for multilayer circuit

A technology for multi-layer circuits and multi-layer circuit boards, which is applied in the direction of printed circuits and electrical components connected by circuits, non-printed electrical components, etc. And other issues

Inactive Publication Date: 2014-12-24
致茂电子(苏州)有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] In view of the fact that in the prior art, metal-based printed circuit boards (MCPCB; Mental Core PCB) are usually used to solve the problem of heat dissipation, but the technology of metal-based printed circuit boards is mostly limited to single-sided single-layer, single-sided double-layer Or double-sided single-layer and other thin-film PCB structures cannot be applied to multi-layer circuit boards with more than 4 layers

Method used

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  • High heat conduction apparatus for multilayer circuit
  • High heat conduction apparatus for multilayer circuit
  • High heat conduction apparatus for multilayer circuit

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Embodiment Construction

[0035] The present invention will be described in detail below in conjunction with the accompanying drawings and specific embodiments, but not as a limitation of the present invention.

[0036] see Figure 1 to Figure 4 , figure 1 A three-dimensional schematic diagram of a high thermal conductivity device showing the multilayer circuit provided by the first preferred embodiment of the present invention; figure 2 A three-dimensional exploded schematic diagram showing the high thermal conductivity device of the multi-layer circuit provided by the first preferred embodiment of the present invention; image 3 A three-dimensional exploded schematic diagram showing another viewing angle of the high thermal conductivity device of the multilayer circuit provided by the first preferred embodiment of the present invention; Figure 4 A schematic cross-sectional view showing a high thermal conductivity device of a multi-layer circuit provided by the first preferred embodiment of the pr...

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Abstract

The invention relates to a high heat conduction apparatus for a multilayer circuit. The high heat conduction apparatus comprises a heat conduction substrate, a multi-layer circuit board, and a chip packaging module. The heat conduction substrate includes a setting surface and at least one boss protruded from the setting surface. The multi-layer circuit board is arranged at the heat conduction substrate and has at least one through hole; and the boss passes through the through hole correspondingly. The chip packaging module has at least one hear radiation zone and a plurality of pins; the heat radiation zone is contacted to the boss correspondingly; and the pins arranged around the heat radiation zone are electrically connected to the multi-layer circuit board.

Description

technical field [0001] The present invention relates to a high heat conduction device of a multilayer circuit, especially a kind of perforation through which a boss of a heat conduction substrate is inserted in a multilayer circuit board, so that a chip package module is arranged on the boss and the multilayer circuit board. High thermal conductivity device for layer circuits. Background technique [0002] With the increasingly sophisticated technology development, LED lighting technology has become increasingly mature and has become a necessity for human daily life. However, its power consumption and heat generation will also increase significantly. If the heat cannot be effectively reduced or dissipated, the brightness of the LED will decrease and the deterioration of the components will be accelerated. Therefore, the quality of the heat dissipation substrate is an important part of LED thermal management. [0003] In the existing technology, the metal printed circuit boa...

Claims

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Application Information

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IPC IPC(8): H05K1/18H01L33/64
Inventor 杨兰升吕启铭李泓锡
Owner 致茂电子(苏州)有限公司
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