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Bulk component auto-picking method for use in mounting process of full-automatic chip mounter

An automatic pick-up and placement machine technology, which is applied in the direction of assembling printed circuits with electrical components, can solve the problems of difficult loading of bulk devices, low production efficiency, and long preparation time, and achieve high productivity, low cost, and convenient operation. Effect

Inactive Publication Date: 2014-12-24
SHAANXI BAOCHENG AVIATION INSTR
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

When picking up components during the placement process, the components are picked up by the placement machine in sequence through the operation of the feeder, and bulk components are not used in the production process; for special requirements, it is inevitable to use bulk components At the same time, it is required to re-braid the bulk devices. When braiding, there must be a braiding machine and a braiding substrate for the corresponding devices. For small batch production, there are problems of poor economy and long preparation time. At the same time, it is difficult to load bulk devices. And the production efficiency is low, therefore, it is necessary to improve

Method used

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  • Bulk component auto-picking method for use in mounting process of full-automatic chip mounter

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Embodiment Construction

[0014] Attached below figure 1 An embodiment of the present invention is described.

[0015] A method for a fully automatic placement machine to automatically pick up bulk components during the placement process, comprising the following steps:

[0016] 1) Put the bulk components 1 into the groove body 7 of the bulk material tray 2 adapted to it according to its size. The bulk material tray 2 has a disc body 6 on which several different sizes Tank body group 3, described tank body group 3 is made up of several tank bodies 7 with the same size, the edge plate 4 that blocks the notch at the lower end of the tank body 7 is fixed on the plate body 6, on the edge plate 4 The serial number 5 corresponding to the tank body 7 is made, the components 1 are placed from the end of the serial number 5 and there is no gap between adjacent components 1, and the number of components 1 in the tank body 7 with the same size is the same ;

[0017] 2) Place the bulk material tray 2 with the c...

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Abstract

The invention provides a bulk component auto-picking method for use in a mounting process of a full-automatic chip mounter. The method includes: setting bulk components in matched cells of a bulk tray according to the sizes of the bulk components; the bulk tray in which the components are arranged is placed in a bulk holding area of the full-automatic chip mounter; initial positions, tail position, the number of rows and the number of columns of the components in the bulk tray are entered via a control panel of the full-automatic chip mounter; the full-automatic chip mounter automatically calculates a pickup position of each component; the full-automatic chip mounter is started to automatically pick and mount the components from the bulk tray. The method has the advantages that the structure is simple, operations are convenient, labor and time are saved, reliability is high, the process is simple, the cost is low, the bulk components are convenient to feed, production efficiency is high, and the process of automatically picking the bulk components in the full-automatic chip mounting process can be effectively satisfied.

Description

technical field [0001] The invention relates to a method for a fully automatic chip mounter to automatically pick up bulk components during the chip mount process. Background technique [0002] In the fully automatic placement process, the packaging form of components is required to be coil or tube. When picking up components during the placement process, the components are picked up by the placement machine in sequence through the operation of the feeder, and bulk components are not used in the production process; for special requirements, it is inevitable to use bulk components At the same time, it is required to re-braid the bulk devices. When braiding, there must be a braiding machine and a braiding substrate for the corresponding devices. For small batch production, there are problems of poor economy and long preparation time. At the same time, it is difficult to load bulk devices. And the production efficiency is low, therefore, it is necessary to improve. Contents ...

Claims

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Application Information

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IPC IPC(8): H05K3/30
Inventor 张伟徐鹏波张群利
Owner SHAANXI BAOCHENG AVIATION INSTR