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Resin composition, prepreg, and metal foil-clad laminate

A technology of resin composition and epoxy resin, applied in the direction of metal layered products, coating, thin material treatment, etc., can solve the problems of substrate surface discoloration, low heat resistance, low reflectivity, etc.

Active Publication Date: 2014-12-24
MITSUBISHI GAS CHEM CO INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, laminates using such epoxy resins generally have low heat resistance, so there are problems such as heat treatment in the manufacturing process of the printed circuit board or the LED mounting process, heating or light irradiation when using the LED after mounting, , the surface of the substrate will be discolored, so the reflectivity is significantly reduced

Method used

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  • Resin composition, prepreg, and metal foil-clad laminate
  • Resin composition, prepreg, and metal foil-clad laminate
  • Resin composition, prepreg, and metal foil-clad laminate

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0172]55 parts by mass of an aliphatic epoxy-modified organosilicon compound (X-40-2670 (manufactured by Shin-Etsu Chemical Co., Ltd.)) represented by the following formula (11) and a mass average molecular weight (Mw) were mixed with a homomixer. 45 parts by mass of an epoxy-modified branched imide compound (ELG-941 (acid value 35 mgKOH / g), manufactured by DICCORPORATION) of 33000, methyl tributylphosphine dimethyl phosphate as a phosphorus curing accelerator (PX-4MP (manufactured by Nippon Chemical Industry Co., Ltd.)) 5 parts by mass, titanium dioxide (CR90 (relative to the total of 100 parts by mass of titanium dioxide, SiO 2 Treated as 1 to 5 parts by mass and Al 2 o 3 1 to 3 parts by mass), Ishihara Sangyo Co., Ltd.) 200 parts by mass, wetting and dispersing agent (BYK-W903, BYK Japan KK.) 1.75 parts by mass, silane coupling agent (Z6040, Dow Corning Toray Co., Ltd.)) 3 parts by mass to obtain a varnish. This varnish was diluted to equal times on a mass basis with met...

Embodiment 2

[0176] The compounding quantity of the epoxy-modified organosilicon compound was changed to 45 parts by mass, and the compounding quantity of the epoxy-modified branched imide compound was changed to 55 parts by mass, and the procedure was carried out in the same manner as in Example 1. The varnishes were prepared, resulting in prepregs and double-sided copper-clad laminates.

Embodiment 3

[0178] The compounding quantity of the epoxy-modified organosilicon compound was changed to 55 parts by mass, the compounding quantity of the epoxy-modified branched imide compound was changed to 35 parts by mass, and as an alicyclic epoxy resin, further compounded 2 , 1,2-epoxy-4-(2-oxilanyl (oxylanyl)) cyclohexane adduct of 2-bis(hydroxymethyl)-1-butanol (EHPE-3150 (Daicel Corporation .production) except that 10 mass parts were carried out similarly to Example 2, and the varnish was prepared, and the prepreg and double-sided copper-clad laminated board were obtained.

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Abstract

Provided are: a resin composition capable of achieving a prepreg or metal foil-clad laminate, etc., that have high light reflectivity in the UV light range and the visible light range, that do not have reduced light reflectivity as a result of heat treatment or light irradiation treatment, that have good peel strength relative to metal foil, that also have excellent heat resistance during moisture absorption, and that have a good external appearance and excellent storage stability; and a prepreg and a metal foil-clad laminate, etc., using same. This resin composition includes at least: an epoxy-modifying silicone compound (A); a branched imide resin (B) having an isocyanurate group and a carboxyl group; a phosphorus-based curing accelerator (C); titanium dioxide (D); and a dispersant (E). The branched imide resin (B) is ideally at least one type selected from a group comprising an epoxy-modifying branched imide resin, an alcohol-modifying branched imide resin, and an amine-modifying branched imide resin.

Description

technical field [0001] The present invention relates to a resin composition, a prepreg using the same, a metal foil-clad laminate, and a printed circuit board, and particularly relates to materials that can be suitably used for printed circuit boards, especially printed circuit boards for mounting light-emitting diodes (LEDs) And other resin compositions, prepregs and metal-clad laminates. Background technique [0002] Conventionally, laminated boards obtained by impregnating a glass woven fabric with an epoxy resin containing titanium dioxide and then heat-hardening are known as printed wiring boards for mounting LEDs (for example, refer to Patent Document 1). However, laminates using such epoxy resins generally have low heat resistance, so there are problems such as heat treatment in the manufacturing process of the printed circuit board or the LED mounting process, heating or light irradiation when using the LED after mounting, , the substrate surface will be discolored,...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08G59/40B32B15/08C08J5/24C08K3/20C08K5/54C08L63/00H05K1/03
CPCH05K1/0373H05K2201/0209H05K2201/2054C08G77/14B32B5/022B32B5/024B32B15/14B32B2260/021B32B2260/046B32B2262/0261B32B2262/0276B32B2262/10B32B2262/101B32B2307/306B32B2307/734B32B2457/08C08J2383/06C08J2479/08C08K2003/2241Y10T428/31529Y10T156/10C09D183/06C08J5/244C08J5/249C08L79/08C08L83/06C08L79/04C08K3/22C08K9/02C08L63/00C08G77/38C08G73/06C08G59/40C08K5/54C08J5/24B32B15/08C08K2201/003H05K1/056
Inventor 高田圭辅平野俊介森下宏治河合英利古贺雄一加藤祯启
Owner MITSUBISHI GAS CHEM CO INC