epoxy adhesive composition

A technology of epoxy adhesive and hardener composition, which is applied in the direction of adhesive types, adhesives, epoxy resin glue, etc., can solve the problems of reducing residual stress, loss of fluidity, and not allowing gravity feeding, etc., to achieve Effect of improving toughness and high adhesive performance

Inactive Publication Date: 2016-09-28
BLUE CUBE IP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Tougheners are often included in the bondline to reduce residual stress, resulting in a loss of fluidity of the individual epoxy and amine hardener components prior to mixing, thus not allowing gravity feed options
Existing compositions do not have the desired balance between flowability and resistance to sagging, dripping and migration, and low (below 5 MPa) residual stress requirements

Method used

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  • epoxy adhesive composition
  • epoxy adhesive composition
  • epoxy adhesive composition

Examples

Experimental program
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Embodiment 1 and 2

[0131] The curable compositions of the present invention (Examples 1 and 2) were prepared by combining a resin component and a hardener component to form a curable composition. Table V shows the curable compositions of Examples 1 and 2, which constitute formulated adhesive compositions, based on the weight ratio of the resin component to the hardener component.

[0132] Table V

[0133]

[0134] figure 1 The rheology of the inventive adhesive composition of Example 1 is shown in . figure 1 A graphical illustration of the formulated adhesive of Example 1 and the viscosity profile of the individual components is shown in . The epoxy resin and hardener components in the composition of Example 1 have relatively low viscosity and exhibit near Newtonian fluid behavior. However, the adhesive mixture is highly viscous and sag resistant.

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Abstract

A curable epoxy adhesive composition comprising (a) at least one first epoxy resin; (b) at least one first diluent; (c) at least one first hardener; (d) having at least a first hydrophilic filler of a predetermined aspect ratio; (e) at least a second hydrophobic filler different from the first filler and having a predetermined aspect ratio; and (f) at least one hydrophobic filler different from said first and second fillers. A third filler; wherein the third filler has a predetermined aspect ratio higher than that of the first filler and the second filler; and wherein the volume ratio of the third filler to the combination of the first filler and the second filler In the range of 1:1 to 10:1, thereby minimizing the thermal residual stress of the cured product prepared from the cured composition.

Description

technical field [0001] This invention relates to epoxy resin adhesive compositions. More specifically, the present invention relates to rheology-controlled epoxy adhesive compositions having low residual stress. Background technique [0002] Sag resistance is known to be an important and highly desirable property of adhesive compositions, particularly those adhesive compositions used in applications where the adhesive is applied to vertical surfaces. Many two-part epoxy adhesives with no-sag properties are known in the art and are commercially available. [0003] Sag resistance of prior art adhesive compositions is generally achieved by utilizing known thixotropic fillers in the adhesive components. Such thixotropic fillers include fumed silica and other similar materials. While the use of fumed silica to improve thixotropy does provide no-sag characteristics to the adhesive composition, the presence of a substantial amount of fumed silica in the adhesive composition also...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09J163/00C08K3/00C08K3/40C08K3/36C08K9/06C08K7/14C08G59/50
CPCC08G59/50C08K2201/016C09J163/00C08K7/14C08K3/36C09J2463/00
Inventor B·巴利杰帕利T·西奥法努斯B·霍伊维尔K·E·弗彻塞H·Q·法姆
Owner BLUE CUBE IP
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