Polyimide coating and baking method

Abstract

The invention provides a low-cost, low-defect-density high-viscosity polyimide coating and baking method, which comprises the following steps in sequence: coating a tackifier on the surface of a wafer; Carry out the first baking to the wafer of sticky agent; Carry out the first cooling to the wafer of described first baking; Coating polyimide on the wafer surface after described first cooling; To described coating The wafer with polyimide is subjected to the second baking; the second baked wafer is subjected to the second cooling; the second cooled wafer is subjected to ultraviolet baking, and the ultraviolet baking The mode of co-heating with vacuum suction cup and deep ultraviolet lamp is adopted. The embodiment of the present invention solves the problem of bubble defects caused by the high viscosity of PI glue, thereby improving the product yield and imaging quality.

Description

technical field [0001] The invention relates to the technical field of MEMS, in particular to a polyimide coating and baking method with low cost and low defect density. Background technique [0002] MEMS (Micro Electro Mechanical System) is an advanced manufacturing technology platform. It is developed on the basis of semiconductor manufacturing technology. MEMS technology adopts a series of existing technologies and materials such as photolithography, corrosion, and thin film in semiconductor technology. Infrared sensors with superior performance can be manufactured using advanced MEMS micromachining technology. Today, infrared sensors are used more and more widely, such as non-contact rapid measurement of body temperature in medicine, which is of great significance in the need to measure the temperature of a large number of people; in addition, it is also used in scientific research and military, such as Infrared spectrometer, missile guidance, thermal imaging, laser d...

Images