Metal framework and electrostatic discharging ring integrated structure for fingerprint sensor and manufacturing method thereof

Abstract

The invention relates to a metal framework and electrostatic discharging ring integrated structure for a fingerprint sensor and a manufacturing method of the metal framework and electrostatic discharging ring integrated structure. The metal framework and electrostatic discharging ring integrated structure comprises a metal framework (1), wherein a groove is formed in the front side of the metal framework (1), an electrostatic discharging ring (10) is arranged on the periphery of the groove, a base island (2) and a pin (3) are arranged in the groove, the base island (2) comprises an upper base island portion and a lower base island portion, the pin (3) comprises an upper pin portion and a lower pin portion, a sensing chip (5) is arranged on the front side of the upper portion of the base island through chip mounting glue (4), and the front side of the sensing chip (5) is connected with the front side of the upper portion of the pin through a metal bonding wire (6). The metal framework and electrostatic discharging ring integrated structure for the fingerprint sensor and the manufacturing method of the metal framework and electrostatic discharging ring integrated structure have the advantages that the electrostatic discharging ring and the metal framework are of the integrated structure, the manufacturing technology is simple, the problem of position offset caused when a traditional electrostatic discharging ring is assembled to a framework is avoided, the matching accuracy of the positions of the electrostatic discharging ring and the sensing chip is improved, and thus the recognition effect of the sensing chip is improved.

Description

technical field [0001] The invention relates to a fingerprint sensor structure and a manufacturing method of an electrostatic discharge ring with an integrated metal frame, belonging to the technical field of fingerprint recognition sensor packaging. Background technique [0002] The surface of the fingerprint recognition sensor package structure often generates static electricity due to the touch of the user's finger, and the static electricity may discharge to the internal circuit or sensor of the package body, causing breakdown and damage to the internal circuit or sensor. [0003] In the existing technology, to achieve electrostatic discharge, such as Apple's patent AU2013100571A4, a circle of electrostatic discharge ring is assembled on the periphery of the induction chip on the front of the substrate. The electrostatic release ring is subsequently configured on the sensor chip or the front of the substrate. There may be problems with the position shift of the electrost...

AI Technical Summary

Problems solved by technology

[0004] The object of the present invention is to overcome above-mentioned deficiency, provide a kind of integral metal frame electrostatic discharge ring to be used in fingerprint sensor structure and manufacturing method, its electrostatic release ring is formed by the metal ring that metal carrier plate half-etchs reservation, static discharge ring and metal The frame is integrated into one structure, the process is simple and the electrostatic discharge has no resistance, which avoids the position shift caused by the secondary assembly of the traditional electrostatic discharge ring on the carrier board and the resistance impedance problem caused by the poor combination, and improves the electrostatic discharge The matching accuracy of the position of the ring and the sensor chip, thereby improving the recognition effect of the sensor chip, and also achieving a better effect of electrostatic discharge

Images