A kind of laminated thin film solar cell and its manufacturing method
A thin-film solar cell and manufacturing method technology, applied in final product manufacturing, sustainable manufacturing/processing, circuits, etc., can solve problems such as high absorption coefficient, narrow band gap of amorphous silicon-based thin films, and unmatched solar spectrum. , to achieve the effect of high photoelectric conversion efficiency
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Embodiment 1
[0016] On the glass substrate, a thin layer of Mo with a thickness of ~10nm is deposited by DC magnetron sputtering technology (atmospheric pressure ~1.2-1.5pa, temperature ~400°C);
[0017] Then linearly reduce the gas pressure to ~0.2-0.5Pa, sputter ~1μm thick Mo thin layer;
[0018] Deposit ~3μm thick CIGS (atomic ratio Cu / (In+Ga)~0.88, Ga / (In+Ga)~0.3) absorption layer; use chemical bath deposition (ZnSO4 (0.16M), ammonia (7.5M), sulfur Urea (0.6M)) to prepare ~10 μm thick ZnS buffer layer;
[0019] A dense ZnO film with a thickness of ~50nm was prepared by sputtering;
[0020] Anneal the ZnO thin film at 450°C for 30min;
[0021] Using PECVD process, in SiH 4 ,PH 3 , CO 2 , H 2 Deposit a n-type heavily doped a-SiOx:H transition layer with a thickness of ~10nm under the atmosphere;
[0022] Using PECVD process, in SiH 4 , BF 3 , CO 2 , H 2 Deposit a p-type heavily doped a-SiOx:H back electrode layer with a thickness of ~10nm under the atmosphere;
[0023] Using ...
Embodiment 2
[0028] On the glass substrate, use DC magnetron sputtering technology (atmospheric pressure ~1.2-1.5pa, temperature ~400℃) to deposit ~10nm thick Mo thin layer;
[0029] Then linearly reduce the gas pressure to ~0.2-0.5Pa, sputter ~1μm thick Mo thin layer;
[0030] Deposit ~3μm thick CIGS (atomic ratio Cu / (In+Ga)~0.88, Ga / (In+Ga)~0.3) absorption layer; use chemical bath deposition (ZnSO4 (0.16M), ammonia (7.5M), sulfur Urea (0.6M)) to prepare ~10 μm thick ZnS buffer layer;
[0031] A dense ZnO film with a thickness of ~50nm was prepared by sputtering;
[0032] Anneal the ZnO thin film at 450°C for 30min;
[0033]Using PECVD process, in SiH 4 ,PH 3 , CO 2 , H 2 Deposit a n-type heavily doped a-SiOx:H battery transition layer with a thickness of ~10nm under the atmosphere;
[0034] Using PECVD process, in SiH 4 , BF 3 , CO 2 , H 2 Deposit a p-type heavily doped a-SiOx:H battery back electrode layer with a thickness of ~10nm under the atmosphere;
[0035] Using PECVD ...
Embodiment 3
[0043] On the glass substrate, use DC magnetron sputtering technology (atmospheric pressure ~1.2-1.5pa, temperature ~400℃) to deposit ~10nm thick Mo thin layer;
[0044] Then linearly reduce the gas pressure to ~0.2-0.5Pa, sputter ~1μm thick Mo thin layer;
[0045] A CZTS absorbing layer with a thickness of ~3 μm was prepared by co-evaporation technology; a ZnS buffer layer with a thickness of ~10 μm was prepared by chemical bath deposition (ZnSO4 (0.16M), ammonia water (7.5M), and thiourea (0.6M));
[0046] A dense ZnO film with a thickness of ~50nm was prepared by sputtering;
[0047] Anneal the ZnO thin film at 450°C for 30min;
[0048] Using PECVD process, in SiH 4 ,PH 3 , CO 2 , H 2 Deposit a n-type heavily doped a-SiOx:H transition layer with a thickness of ~10nm under the atmosphere;
[0049] Using PECVD process, in SiH 4 , BF 3 , CO 2 , H 2 Deposit a p-type heavily doped a-SiOx:H back electrode layer with a thickness of ~10nm under the atmosphere;
[0050] U...
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