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Method to prevent pitting of LED chip electrodes when evaporating aluminum

A LED chip and evaporation technology, which is applied in the direction of circuits, electrical components, semiconductor devices, etc., can solve the problems of pitting caused by the growth of aluminum film, and achieve the effect of high reliability and strong operability

Active Publication Date: 2017-08-25
XIANGNENG HUALEI OPTOELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] The purpose of the present invention is to overcome the above-mentioned shortcomings, and provide a method for preventing pitting of LED chip electrodes during evaporation of aluminum, which can effectively solve the problem of pitting in the growth of aluminum film

Method used

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  • Method to prevent pitting of LED chip electrodes when evaporating aluminum
  • Method to prevent pitting of LED chip electrodes when evaporating aluminum
  • Method to prevent pitting of LED chip electrodes when evaporating aluminum

Examples

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Embodiment 1

[0031] The principle of the present invention is: the aluminum film is divided into small parts, the thickness of each small part of aluminum is relatively thin, the time used for vapor deposition of this small part of aluminum is short, and the aluminum particles have no time to form larger particles. When the next part of aluminum is vapor-deposited again after a certain time interval, the aluminum particles need to re-nucleate, re-grow and re-form a film, and cannot directly grow on the previous layer of aluminum film.

[0032] Please refer to image 3 , the method for preventing the LED chip electrode from producing pits when evaporating aluminum in this embodiment includes: dividing the aluminum film with a thickness of N into n partial layers and evaporating them separately, N=N 1 +N 2 +…+N n , the interval time for vapor deposition of each partial layer is 5 seconds to 60 seconds, until the entire aluminum film is evaporated.

[0033] Preferably, the N 1 =N 2 =…=N ...

Embodiment 2

[0039] In this embodiment, the method for preventing pitting of LED chip electrodes during vapor deposition of aluminum includes: dividing the aluminum film with a thickness of N into n partial layers for respective vapor deposition, N=N 1 +N 2 +…+N n , the interval time for vapor deposition of each partial layer is 5 seconds to 60 seconds, until the entire aluminum film is evaporated.

[0040] When this method is used to vapor-deposit metal aluminum in this embodiment, although the total thickness of the aluminum is relatively thick, every small part of the aluminum is relatively thin. In this way, no matter how thick the total thickness of the final aluminum film is, the aluminum particles cannot grow into larger particles. There are no larger aluminum particles which means no pitting. Because the problem of pitting caused by the growth of the aluminum film is successfully solved by layered evaporation of aluminum.

[0041] In a specific embodiment, taking an aluminum-th...

Embodiment 3

[0045] In this embodiment, the method for preventing pitting of LED chip electrodes during vapor deposition of aluminum includes: dividing the aluminum film with a thickness of N into n partial layers for respective vapor deposition, N=N 1 +N 2 +…+N n , the interval time for vapor deposition of each partial layer is 5 seconds to 60 seconds, until the entire aluminum film is evaporated.

[0046] When this method is used to vapor-deposit metal aluminum in this embodiment, although the total thickness of the aluminum is relatively thick, every small part of the aluminum is relatively thin. In this way, no matter how thick the total thickness of the final aluminum film is, the aluminum particles cannot grow into larger particles. There are no larger aluminum particles which means no pitting. Because the problem of pitting caused by the growth of the aluminum film is successfully solved by layered evaporation of aluminum.

[0047] In a specific embodiment, taking an aluminum-th...

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Abstract

The invention discloses a method for preventing an LED chip electrode from generating pits during aluminum evaporation. The method includes the steps that an aluminum coating with the thickness being N is divided into n part layers for evaporation respectively, wherein the N is equal to a sum of N1, N2 ... and Nn, and the time interval between every two part layers during evaporation ranges from 5 seconds to 60 seconds until evaporation on the whole aluminum coating is completed; or an aluminum coating with the thickness being N is divided into n part layers for evaporation respectively, wherein N is equal to a sum of N1, N2 ... and Nn, the N1, the N2 ... and the Nn are equal, the time interval between every two part layers during evaporation is 10 seconds until the evaporation on the whole aluminum coating is completed; the time intervals of the part layers during evaporation are equal. The evaporation is carried out at the rate being 5-25A / s under the condition that the temperature ranges from 20 DEG C to 50 DEG C. The method has the advantages that operability is high, and aluminum particles cannot grow into large aluminum particles; reliability is high, and influences on the yield are avoided.

Description

technical field [0001] The invention belongs to the technical field of semiconductors, and relates to a method for preventing pitting of LED chip electrodes when aluminum is evaporated. Background technique [0002] A light-emitting diode (Light-Emitting Diode, referred to as LED) is a semiconductor electronic component that can convert electrical energy into light energy. This electronic component appeared as early as 1962. In the early days, it could only emit red light with low luminosity. Later, other monochromatic light versions were developed. Today, the light that can be emitted has covered visible light, infrared rays and ultraviolet rays, and the luminosity has also increased to a considerable extent. of luminosity. And the use is also used as indicator lights, display panels, etc. from the beginning; with the continuous advancement of technology, light-emitting diodes have been widely used in displays, TV lighting decoration and lighting. [0003] Vacuum evaporat...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L33/40H01L33/38H01L33/00
CPCH01L33/005H01L33/38H01L33/40H01L2933/0016
Inventor 胡弃疾苗振林汪延明
Owner XIANGNENG HUALEI OPTOELECTRONICS
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