Preparation device and method of gold-tin thin film
A thin film preparation, gold-tin technology, applied in metal material coating process, vacuum evaporation plating, coating, etc., can solve the problems of thin film composition ratio control and unsatisfactory film quality, and achieve dense structure and uniform composition distribution , the effect of high application value
Active Publication Date: 2016-06-08
SHANGHAI INST OF OPTICS & FINE MECHANICS CHINESE ACAD OF SCI
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Problems solved by technology
[0008] The purpose of the present invention is to overcome the deficiencies of the existing film preparation methods and the problems of unsatisfactory composition ratio control and film formation quality in the film, and provide a preparation device and method for gold-tin film, which can accurately control the thickness of Au and Sn in the AuSn film and ratio, the obtained thin film has the characteristics of dense structure and uniform composition distribution, which has high application value in the field of semiconductor laser packaging
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[0029] The implementation method is as follows: in order to prepare a gold-tin alloy with a certain thickness and ratio, the number of layers of the vapor-deposited Au layer and the Sn layer is determined in advance, and then the Au layer and the ratio of the Au layer and the Sn layer are calculated according to the total thickness of the gold-tin alloy and the ratio of Au and Sn. The thickness of the Sn layer; calculate the quality of the vapor-deposited Au ball and Sn ball according to the total thickness of the Au layer and the Sn layer, and then calculate the Au ball and the Sn ball according to the number of the Au ball and the Sn ball is the same as the number of layers. diameter; the parts to be coated (pre-steamed face down) are installed on the workpiece frame 15, the Au ball 21 of a certain diameter is placed in the evaporation boat, and the Sn ball 22 of a certain diameter is placed on the upper plane of the chute 17, Then put a certain number of Au balls and Sn ball...
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A device and a method for preparing an Au-Sn film are disclosed. The device comprises an evaporation chamber, a revolution axis, a revolution plate, a fixed shaft, a workpiece frame, a push rod, a support frame, a chute, electrodes and an evaporation boat. An Au ball and a Sn ball roll along the chute and drop on the evaporation boat by virtue of movement of a push rod to realize preparation of the AuSn film. According to the invention, thickness and proportion of Au and Sn in the AuSn film can be controlled precisely, and the obtained film has the characteristics of compact structure and uniform component distribution, and has very high application value in the field of semiconductor laser packaging.
Description
technical field [0001] The invention belongs to the field of thin film preparation, and relates to a preparation device and method for a gold-tin thin film. Background technique [0002] Gold tin (abbreviated as AuSn) solder has received extensive attention because of its excellent mechanical properties and thermal properties. Since gold accounts for a certain proportion of the alloy composition, the surface oxidation degree of the material is low. If vacuum or The combination of reducing gases such as nitrogen and hydrogen eliminates the need for chemical fluxes, which is one of the most attractive features and is most important for electronic device packaging, especially optoelectronic device packaging. The AuSn alloy has good wettability and has no corrosion phenomenon to the lead-free tin solder of the gold-plated layer. The composition of the gold-tin alloy and the gold-plated layer is close, so the immersion degree of the very thin plating layer by diffusion is very lo...
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IPC IPC(8): C23C14/14C23C14/26
CPCC23C14/14C23C14/26C23C14/542
Inventor 孙广伟辛国锋皮浩洋封惠忠于阿滨蔡海文瞿荣辉
Owner SHANGHAI INST OF OPTICS & FINE MECHANICS CHINESE ACAD OF SCI