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White light LED light source device and manufacturing method thereof

A technology of LED light source and manufacturing method, applied in the direction of electric solid-state devices, semiconductor devices, electrical components, etc., can solve problems such as reduced adhesion of crystal-bonding glue, abnormal electrical connections of devices, and difficulties in production operations, so as to reduce abnormal electrical connections , suitable for production operations, strong adhesive effect

Active Publication Date: 2017-03-22
SHENZHEN SMALITE OPTOELECTRONICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the disadvantage of this structure is that the bonding force between the LED chip and the support is low because the adhesiveness of the crystal-bonding glue mixed with the fluorescent substance will be reduced. After the LED chip is bonded on the support, During the wire bonding process, the pressure of the wire bonding can easily cause the LED chip to lift, shift, and detach from the support, which will cause difficulties in the production operation. In addition, during the lighting application process of the light source device, due to the different coefficients of thermal expansion of different materials, the inside of the device The accumulated high heat is more likely to cause the detachment of the die-bonding glue from the support or the detachment of the LED chip from the die-bonding glue, which will lead to failures such as abnormal electrical connection of the device and dead lights.

Method used

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  • White light LED light source device and manufacturing method thereof
  • White light LED light source device and manufacturing method thereof
  • White light LED light source device and manufacturing method thereof

Examples

Experimental program
Comparison scheme
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specific Embodiment approach 1

[0022] see Figure 1-2 , the specific embodiment adopts the following technical solutions: its production method: 1. mix fluorescent glue with fluorescent powder and glue to prepare fluorescent glue, and use the prepared fluorescent glue to bond the second transparent support to the first metal electrode on it. 2. Bond the LED chip on the second transparent support with transparent glue and cure the glue; 3. Use metal wires to connect the LED chip and The LED chip, the LED chip and the metal electrode are connected to form an electrical connection between the LED chips and between the LED chip and the metal electrode. 4. Covering the second phosphor layer on the first transparent support, so that the surrounding structure formed by the first phosphor layer and the second phosphor layer surrounds the second transparent support and the LED chip.

[0023] The white LED light source device includes a first transparent support 1, a metal electrode 2, a second transparent support 3...

specific Embodiment approach 2

[0029] see Figure 3-4 The difference between this specific embodiment and specific specific embodiment 1 is that a metal wire 8 is provided between adjacent LED chips, and the adjacent LED chips are connected to each other through the metal wire 8 as a medium and the metal lead wire 5 , the other components and connections are the same as those in the first embodiment.

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Abstract

A white-light LED light source device and a manufacturing method especially relate to the technical field of LEDs. Metal electrodes (2) are respectively arranged at the two sides of a first transparent supporting member (1). A second transparent supporting member (3) is fixed to the upper end of the first transparent supporting member (1). A plurality of LED chips (4) are arranged at the upper end of the second transparent supporting member (3). The LED chips (4) and the metal electrodes (2) are connected via metal lead wires (5). The upper ends of the first supporting member (1), the second transparent supporting member (3) and the LED chips (4) are respectively coated with a second phosphor powder layer (7). The white-light LED light source device can achieve a 360-degree light emitting effect, and adhesion between the LED chips and the supporting members is firm and reliable. Phenomena such as LED chip upwarp, shift and separation from the supporting members cannot be generated easily during the wire welding process.

Description

[0001] Technical field: [0002] The invention relates to the technical field of LEDs, in particular to a white LED light source device and a manufacturing method. [0003] Background technique: [0004] Due to the characteristics of high luminous efficiency, no pollution, and rich colors, LED light source devices are being widely used in TV backlights, graphic display screens, decorative lighting, commercial lighting and other fields. With the reduction of cost and the continuous improvement of heat dissipation performance, LED light source devices are rapidly entering the field of general lighting, and white LED light sources are gradually replacing traditional lighting sources such as incandescent lamps and fluorescent lamps. At present, white LED light sources are generally obtained by exciting fluorescent substances with blue LED chips. The general practice of white light LED light source devices is to fix the LED chip on a support, cover the LED chip with fluorescent mat...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L33/50H01L33/62
CPCH01L25/0753H01L33/486H01L33/505H01L33/62H01L2933/0041
Inventor 柳欢李俊东
Owner SHENZHEN SMALITE OPTOELECTRONICS CO LTD