Method and device for regulating cooling of terminal and terminal
A control device and a control device technology, applied in the direction of instruments, electrical digital data processing, digital data processing components, etc., can solve the problem of increased fan energy consumption, large temperature difference between two CPUs, and inability to dynamically adjust the temperature of two CPUs, etc. question
Inactive Publication Date: 2015-01-28
HANGZHOU HUAWEI DIGITAL TECH
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Problems solved by technology
[0003] The CPU of the blade server is affected by the wiring, and the CPU needs to be arranged in series. As the power consumption of the CPU increases, the CPU placed at the rear is greatly affected by the temperature of the CPU at the front. The existing cooling system adjusts the speed according to the temperature of the two CPUs. When the temperature of a CPU is too high, the fan speed is too high, resulting in high system noise, and the power consumption of the fan is increased, and the power consumption is large.
However, the existing radiator design adopts low front and high rear, and a windshield structure is added above the front low-wen radiator. However, since the ventilation volume of the windshield structure is fixed, it can only ensure the maximum load of the CPU and the two CPUs. The temperature difference is 0
When the CPU load changes greatly, the temperature difference between the two CPUs is large, and the existing above-mentioned structure cannot realize dynamic adjustment of the temperature of the two CPUs.
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[0043] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present invention.
[0044] see figure 1 , the present invention provides a terminal cooling control method, the method cools the first heating element and the second heating element of the terminal through an air volume control device, which includes:
[0045] Step S1, acquiring the temperature of the first heating element and the temperature of the second heating element;
[0046] Step S2, when it is determined that the temperature of the first heating element is higher than the tem...
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The invention provides a method and a device for regulating cooling of a terminal and the terminal. The method comprises the following steps of enabling an air quantity control device to control a first heating element and a second heating element of the terminal, and obtaining the temperature of the first heating element and the temperature of the second heating element; when determining that the temperature of the first heating element is higher than the temperature of the second heating element, regulating the temperature lowering of the first heating element; continuing to obtain the temperature of the first heating element and the temperature of the second heating element; when determining that the temperature of the first heating element is lower than the temperature of the second heating element, and the number of times of the temperature of the first heating element lower than the temperature of the second heating element is equal to preset number of times, regulating the temperature lowering of the second heating element.
Description
technical field [0001] The invention relates to a terminal cooling control method and a terminal. Background technique [0002] Currently, most servers use air cooling to cool devices. The heat of the device is taken away by the cooling gas passing through the chip, and the temperature of the device is affected by the temperature and air volume of the cooling gas. [0003] The CPU of the blade server is affected by the wiring, and the CPU needs to be arranged in series. As the power consumption of the CPU increases, the CPU placed at the rear is greatly affected by the temperature of the CPU at the front. The existing cooling system adjusts the speed according to the temperature of the two CPUs. When the temperature of a CPU is high, the fan speed is high, resulting in high system noise, and the power consumption of the fan increases, resulting in high power consumption. However, the existing radiator design adopts low front and high rear, and a windshield structure is add...
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IPC IPC(8): G06F1/20
CPCG06F1/206
Inventor 黄秋月钟杨帆姚益民邱少真
Owner HANGZHOU HUAWEI DIGITAL TECH