Semiconductor refrigeration refrigerator and its hot end heat exchange device

Abstract

The invention provides a semiconductor refrigeration refrigerator and a hot-end heat exchange device thereof. The hot-end heat exchange device comprises a hot-end heat transfer plate and a plurality of heat dissipation ring-shaped heat pipes, wherein the hot-end heat transfer plate is provided with a heat exchange face in hot connection with a heat source; the heat dissipation ring-shaped heat pipes are sequentially arranged in a plane parallel to the heat exchange face in a spacing manner in the radial direction, and the lower part of each of the heat dissipation ring-shaped heat pipes is in contact with the hot-end heat transfer plate for heat exchange and is upwardly arranged along the plane parallel to the heat exchange face. According to the technical scheme of the invention, the heat dissipation ring-shaped heat pipes in the hot-end heat exchange device effectively transfer heat transmitted by the hot-end transfer plate to the ambient environment, the occupied area is small, and contribution is made for matching of the hot-end heat exchange device and the refrigerator structure.

Description

Technical field [0001] The present invention relates to refrigeration equipment, in particular to a semiconductor refrigeration refrigerator and its hot end heat exchange device. Background technique [0002] Semiconductor refrigeration refrigerators are also called thermoelectric refrigerators. It uses semiconductor refrigeration fins to realize refrigeration through high-efficiency ring-shaped double-layer heat pipe heat dissipation and conduction technology and automatic variable pressure and variable flow control technology. No refrigeration working fluid and mechanical moving parts are required, which solves the application problems of traditional mechanical refrigeration refrigerators such as medium pollution and mechanical vibration. . [0003] However, the cold end of the semiconductor cooling fins will generate a lot of heat at the hot end at the same time. In order to ensure the reliable and continuous operation of the semiconductor cooling fins, the hot end needs to be ...

AI Technical Summary

Problems solved by technology

[0003] However, the cold end of the semiconductor refrigeration chip will generate a large amount of heat at the hot end while cooling. In order to ensure the reliable and continuous operation of the semiconductor refrigeration chip, it is necessary to dissipate heat from the hot end in time. The heat dissipation of the hot end of the sheet generally uses the heat sink to exchange heat with the surrounding environment. This method has low heat dissipation efficiency and limits the development of semiconductor refrigeration refrigerators.

[0004] At present, in the existing technology, there is a scheme of forced convection cooling of the heat sink by setting a fan to improve the heat exchange efficiency, but the heat dissipation fin itself is relatively large in size, and the installation of a fan takes up more space in the refrigerator

After the fan is started, it will cause increased noise, and the fan will work continuously, and the reliability is also poor

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