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Light emitting diode packaging structure and light source module

A technology of light-emitting diodes and packaging structures, applied in the direction of electrical components, electric solid-state devices, circuits, etc., can solve the problems of expensive, light-emitting diodes cannot be priced, and achieve high color rendering effects

Active Publication Date: 2017-03-01
GIO OPTOELECTRONICS CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] However, at present, the main reason why light-emitting diodes are still unable to become the light source of mainstream lighting equipment is the problem of color rendering index (CRI) besides the high price.

Method used

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  • Light emitting diode packaging structure and light source module
  • Light emitting diode packaging structure and light source module
  • Light emitting diode packaging structure and light source module

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Experimental program
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Embodiment Construction

[0023] Hereinafter, the light emitting diode package structure and the light source module according to the preferred embodiments of the present invention will be described with reference to related drawings, wherein the same components will be described with the same reference signs.

[0024] Please refer to figure 1 As shown, it is a schematic diagram of a light emitting diode packaging structure 1 according to a preferred embodiment of the present invention.

[0025] The light-emitting diode packaging structure 1 of the present invention is, for example, but not limited to, PLCC (Plastic Leaded Chip Carrier), EMC (epoxy molding compound), SMC (Silicon Molding Compound), COB (chip-on-board) or other types of lead frames, or Ceramic package.

[0026] The light emitting diode packaging structure 1 includes a plurality of light emitting diode chips 11, a first wavelength conversion material 12 and a second wavelength conversion material 13.

[0027] The peak value of the light emission...

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Abstract

The invention relates to a light emitting diode packaging structure and a light source module. The light emitting diode packaging structure comprises a plurality of light emitting diode chips, a first wavelength conversion material and a second wavelength conversion material, wherein the peak value of a light emitting wave of each light emitting diode chip is 300nm-475nm or 580nm-800nm, each light emitting diode chip comprises at least two blue light emitting diode chips, the difference of the peak values of the light emitting waves of the blue light emitting diode chips is 10nm-30nm, the peak value of a transmitting wave of the first wavelength conversion material is 500nm-585nm, the peak value of a transmitting wave of the second wavelength conversion material is 585nm-700nm, and the first wavelength conversion material and the second wavelength conversion material cover the light emitting diode chips together.

Description

Technical field [0001] The invention relates to a light emitting diode packaging structure and a light source module. Background technique [0002] In recent years, as the production technology of light-emitting diodes (Light Emitting Diode, LED) has become more and more advanced, its application range has become more and more extensive. From the early use of indicator lights, it has become the light source of main lighting products. With its advantages of power saving, high efficiency, high brightness and multiple changes, it has gradually become the mainstream energy-saving lighting products. Therefore, a variety of LED lighting devices have also come out. [0003] However, the main reason why light-emitting diodes still cannot become the light source of mainstream lighting equipment is expensive, and the main reason is the color rendering index (CRI) problem. Among them, if the color presented by a light source illuminating a colored object is the same degree as the color seen ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L25/075H01L33/48H01L33/50
Inventor 胡顺源朱修民
Owner GIO OPTOELECTRONICS CORP