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Power semiconductor device and method of manufacturing same

A technology of power semiconductors and semiconductors, applied in semiconductor/solid-state device manufacturing, semiconductor devices, electric solid-state devices, etc.

Inactive Publication Date: 2015-02-11
SAMSUNG ELECTRO MECHANICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, Patent Document 1 does not disclose the feature that the width and concentration of the second conductivity type pillars each change in the longitudinal direction or the height direction of the device.

Method used

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  • Power semiconductor device and method of manufacturing same
  • Power semiconductor device and method of manufacturing same
  • Power semiconductor device and method of manufacturing same

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Embodiment Construction

[0061] Hereinafter, embodiments of the present technology will be described in detail with reference to the accompanying drawings. However, this disclosure may be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will convey the general scope of the disclosure to those skilled in the art. In the drawings, the shapes and dimensions of elements may be exaggerated for clarity, and the same reference numerals will be used throughout to designate the same or like elements.

[0062] The power switch may be implemented by any of power metal oxide semiconductor field effect transistors (MOSFETs), insulated gate bipolar transistors (IGBTs), several types of thyristors, and devices similar to those previously described. Most of the new technologies disclosed herein will be described in detail in terms of MOSFETs. However, several ...

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Abstract

There is provided a power semiconductor device including: a first semiconductor region of a first conductivity type; second semiconductor regions formed in the first semiconductor region and being of a second conductivity type; a well region formed above the second semiconductor regions and being of the second conductivity type; and a source region formed in the well region and being of the first conductivity type, wherein the second semiconductor regions include 1 to n layers formed from a lower portion of the device extending a in a direction of height of the device, and in the case that the widest width of the of the second semiconductor region of the nth layer is Pn, P1<Pn (n≧2).

Description

[0001] Cross References to Related Applications [0002] This application claims the benefit of Korean Patent Application No. 10-2013-0094957 filed with the Korean Intellectual Property Office on Aug. 9, 2013, the entire disclosure of which is incorporated herein by reference. technical field [0003] The present technology relates to power semiconductor devices and methods of manufacturing the same. Background technique [0004] In general, power semiconductor devices are widely used to control motors or as elements of various switching devices such as inverters. [0005] In detail, a power semiconductor device (semiconductor device used in a power supply device) is a core component of a power supply device that optimally converts or controls power. [0006] Power semiconductor devices have higher breakdown voltages, higher current levels, and higher frequencies than ordinary semiconductor devices. [0007] As typical power semiconductor devices, there are Metal Oxide Sem...

Claims

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Application Information

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IPC IPC(8): H01L27/02H01L21/77
CPCH01L29/66712H01L29/7802H01L29/0611H01L29/063H01L29/0634H01L29/0649H01L29/1095H01L29/66333H01L29/7395H01L29/43H01L29/4916H01L29/66325H01L29/7393H01L29/772
Inventor 宋寅赫朴在勋严基宙徐东秀
Owner SAMSUNG ELECTRO MECHANICS CO LTD