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Server and its cooling components

A heat dissipation component and server technology, applied in the server field, can solve the problem of increasing the cost of memory pseudo-frames and achieve the effect of increasing wind resistance

Active Publication Date: 2017-04-26
INVENTEC PUDONG TECH CORPOARTION +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, such an approach must increase the cost of the memory pseudo-frame
Moreover, when the memory is expanded, the memory pseudo-frame may be treated as waste

Method used

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  • Server and its cooling components
  • Server and its cooling components
  • Server and its cooling components

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Embodiment Construction

[0055] The detailed features and advantages of the present invention are described in detail below in the embodiments, the content of which is sufficient to enable any person with ordinary knowledge in the art to understand the technical content of the present invention and implement it accordingly, and according to the content disclosed in the specification and the scope of the claims With the accompanying drawings, anyone with ordinary knowledge in the art can easily understand the related objects and advantages of the present invention. The following examples are to further describe the viewpoints of the present invention in detail, but not to limit the scope of the present invention in any way.

[0056] Please refer to figure 1 , shows a top view of the server 1 according to an embodiment of the present invention. In this embodiment, the server 1 includes a casing 1 a , a mainboard 1 b , multiple air flow generating devices 40 , multiple central processing units 20 , mult...

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Abstract

A server and a heat dissipating assembly thereof includes an airflow generating device, a central processing unit, several memory slots, a first cooling fin set, a second cooling fin set and a heat conductive member. The airflow generating device generates an airflow flowing along an airflow direction and is located at a front side of the central processing unit. The several memory slots are used to plug of memories, and they are located at a lateral side of a central processing unit. The first cooling fin set is correspondingly located over the central processing unit and at a lateral side of the memory slots. The second cooling fin set is located at a front side of the memory slots and between the airflow generating device and the memory slots. The first cooling fin set is thermally connected with the second cooling fin set via the heat conductive member.

Description

technical field [0001] The invention relates to a server, in particular to a server with a cooling assembly. Background technique [0002] Electronic devices generally include a variety of electronic components. The design of heat dissipation is usually designed for the state when the electronic device is fully loaded with electronic components. However, at the beginning of the use of the electronic device, the electronic device will leave a lot of space for the expansion of other electronic components in the future. However, the flow field when the electronic components are not fully loaded is not the same as the flow field when the electronic components are fully loaded. A design that can dissipate heat can become incapable of dissipating heat. [0003] For example, when the memory (memory) is fully loaded, when the fan blows the airflow to the cooling fins located in the central processing unit and the slots where the memory is inserted, the airflow can evenly blow to ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K7/20
CPCH05K7/20727
Inventor 张晋赵黎明
Owner INVENTEC PUDONG TECH CORPOARTION