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A method for manufacturability specification of electronic products

An electronic product and manufacturing technology, applied in the field of electronic product manufacturability specification, can solve the problems of neglecting product manufacturability, delayed product cycle, long design cycle, etc., to improve the company's professional image, improve productivity, and improve efficiency Effect

Active Publication Date: 2017-05-03
北京三重华星电子科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
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AI Technical Summary

Problems solved by technology

[0002] The traditional design of electronic products always emphasizes the design speed and fast product launch, while ignoring the manufacturability of the product. Therefore, in order to correct the manufacturability of the product, multiple redesigns are required, and the prototype must be remade every time it is improved. , resulting in a long design cycle, high cost, and delays in the product launch cycle

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0023] A method for manufacturability specification of an electronic product, comprising the steps of:

[0024] The evaluation of the following evaluation steps is divided into three levels: 1 point, 3 points, and 5 points; the evaluation of the impact of 5 seconds per block on man-hours, and the evaluation of quality cost increase is 1 point; the evaluation of 10 seconds per block on man-hours, the evaluation of quality cost increase is 3 points; the impact on working hours is greater than 60 seconds per block, and the evaluation of quality cost increase is 5 points;

[0025] (1) BOM evaluation

[0026] The evaluation content is: device name, model, bit number, dosage; resistor size, precision, withstand voltage value, power; capacitor size, precision, withstand voltage value, power; surface coating composition of IC pins;

[0027] (2) Optical point and character evaluation

[0028] The evaluation content is: the manufacturing company mark on the PCB substrate, the UL demon...

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PUM

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Abstract

The invention discloses an electronic product manufacturability specification method and belongs to the technical field of electronic product manufacturing. The method comprises material bill evaluation, optical point and character evaluation, make-up mode evaluation, SMT board design evaluation and wave crest welding design evaluation. According to the method, standardization of the machining technology can be facilitated, the PCB designer level is improved, the management evaluation basis is established, the manufacturability specification is digitalized, the design quality is analyzed, the manufacturing yield is improved, intellectual assets are protected, customer requirements are responded rapidly, research and development knowledge and manufacturing experiment are integrated into an expert system, customer design changes are responded in real time, the new product introduction time is shortened, the company professional image is improved, and the partnership between companies and customers is consolidated.

Description

technical field [0001] The invention belongs to the technical field of electronic product manufacturing, and in particular relates to a method for manufacturability specification of electronic products. Background technique [0002] The traditional design of electronic products always emphasizes the design speed and fast product launch, while ignoring the manufacturability of the product. Therefore, in order to correct the manufacturability of the product, multiple redesigns are required, and the prototype must be remade every time it is improved. , thus resulting in a long design cycle, high cost, and also delays the product launch cycle. [0003] 60% of the total cost of electronic products depends on the original design of the product, 75% of the manufacturing cost depends on the design instructions and design specifications, and 70-80% of the production defects are caused by design defects. Design for manufacturability is to consider manufacturability from the time of p...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/00
CPCH05K3/00H05K2203/162H05K2203/163
Inventor 尹华春余翠丽宋潮
Owner 北京三重华星电子科技有限公司
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