Test point arrangement method for integrated circuit board

Abstract

The invention discloses a test point arrangement method for an integrated circuit board. The method comprises the following steps: according to the area size of the integrated circuit board and the number of test points having the same function, selecting test point module positions; according to the area size of the test point module positions and the number of the test points having the same function, arranging test point modules on the integrated circuit board; and according to the area size of the test point modules and the number of the test points, manufacturing test needle modules matching the test point modules. According to the test point arrangement method for the integrated circuit board, the test points on the integrated circuit board are arranged in a modularization mode according to functions; and it is agreed that the distances between each test point and corresponding adjacent test points are the same, the test point areas on the integrated circuit board look tidy and regular, and debugging personnel can conveniently find each test point with the functions within one function module.

Description

technical field [0001] The invention relates to a testing and debugging method for an integrated circuit board, in particular to a layout method for testing points of an integrated circuit board. Background technique [0002] In the prior art, the test points on the mobile terminal are mainly used to facilitate R&D personnel to test the internal signals of the mobile terminal. In production, the test points are also used to perform necessary tests on the main board functions. All test points are essential functional units of the mobile terminal. [0003] With more and more functions on the mobile terminal, the number of test points used for debugging and production is also increasing day by day, and the device area on the mobile terminal is also getting smaller and smaller, resulting in the distribution of test points everywhere. When making a fixture, it is necessary to locate each test point, which requires a lot of work and low precision. After the test points of the fixt...

AI Technical Summary

Problems solved by technology

When making a fixture, it is necessary to locate each test point, which requires a lot of work and low precision. After the test points of the fixture reach a certain level, maintenance is very complicated due to too many leads. Distributed test points also reduce the debugging speed of developers

[0004] In the prior art, the test points are randomly distributed on the main board of the mobile terminal, and they are placed in a seam-like manner without optimizing the layout, which brings design and maintenance to the development personnel who need to use the test points for subsequent debugging and the production of production fixtures. If the test points are randomly distributed, it means that there must be corresponding test pins on the test fixture that can touch the test points. In this way, the coordinates of the test pins on the test fixture are also chaotic and irregular. It brings a huge workload and also brings huge complexity to the maintenance of the fixture

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