Wafer carrier processing device

Abstract

The invention discloses a machining device for a wafer bearing frame. The machining device is characterized by comprising a film tightening device and a support table, wherein the film tightening device is used for tightening a film in order that the film has tension; the film tightening device is arranged movably; the support table is arranged opposite to the film tightening device, and is used for supporting a film tightening frame; the film tightening device is pressed against the film after moving towards the film in order to tighten the film; and after the film tightening device moves relative to the support table, the film is pressed against the film tightening frame positioned on the support table. Through adoption of the machining device for the wafer bearing frame provided by the invention, machining automation of the wafer bearing frame is realized, and the production efficiency and production yield of the wafer bearing frame are increased greatly.

Description

technical field [0001] The invention relates to the field of wafer manufacturing, in particular to a film sticking device for sticking a film on a stretch film frame carrying a wafer. Background technique [0002] Wafer refers to the silicon wafer used in the production of silicon semiconductor integrated circuits. Because of its circular shape, it is called a wafer. Various circuit element structures can be processed on the wafer. Usually, the surface with the circuit element structure is called the front side, and the opposite side is called the back side. In the process of wafer processing, it is necessary to adhere the wafer to the wafer carrier frame in the multi-channel processing procedure. Such as figure 1 and 2 As shown, the wafer carrier frame includes a stretch film frame 01 and a film 02 . The film 02 is adhered to the stretcher frame 01 . In use, the wafer 03 is adhered to the film 02. When the dicing tool cuts the whole wafer 03 into multiple small chips,...

AI Technical Summary

Problems solved by technology

In the above process, the stability of the manual stretch film is very poor, the tension of the film cannot be adjusted and controlled, and the precision of the stretch film is low

Excessive pulling force of the workers will cause the film to break and be scrapped, reducing the production pass rate; too small pulling force will cause insufficient film tension

Manual stretching will also cause problems such as uneven tension distribution of the film

Insufficient tension or uneven distribution of the film will make the film loose and easy to wrinkle. When the wafer adheres to the film, it cannot be kept flat, which will easily cause the wafer to scatter, deform, break or break, and lose the wafer carrier frame. The bearing effect on the wafer affects the subsequent process

The stability and precision of manual film cutting are also poor, and it is easy to damage the film due to improper operation of workers and scrap it.

The above-mentioned process also has the defect of low production efficiency, which cannot meet the needs of industrialized production.

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