Chip card combination structure and method thereof
A combined structure and chip card technology, which is applied to record carriers, instruments, and electrical components used in machines, can solve the problems of troublesome production, high production costs, and time-consuming, and achieve the effect of reducing costs.
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[0033] see Figure 1 to Figure 4 As shown, it is a schematic diagram of the implementation of a preferred embodiment of the present invention, a schematic diagram of separation, a schematic diagram of a thin film wafer and a schematic diagram of a fixed element. It can be clearly seen from the figure that the present invention includes at least one substrate 1, at least one fixed element 3, and at least one adhesive film 4 and at least one thin film chip 2, in this embodiment, three sizes of general SIM card, micro SIM card and nano SIM card are used as illustrations, and at least one side of the fixing element 3 is formed with at least one corresponding to the substrate 1. fixed slot 31, and the fixed slot 31 is further divided into the first fixed slot 311 (the size is equal to the size of a general SIM card), the second fixed slot 312 (the size is equal to the size of a micro SIM card) and the third fixed slot 313 (the size is equal to the size of a micro SIM card) nano SIM...
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