Vertical continuous plating device

A vertical continuous electroplating, circuit board technology, applied in the electrolysis process, electrolysis components and other directions, can solve the problems of poor electrical contact of conductive rails, connection gap jumping, affecting the electroplating effect, etc., to achieve the effect of easy maintenance, enhanced effect, and convenient disassembly
CN104451846BActive Publication Date: 2017-02-01湖南鸿展自动化设备有限公司
6 Cites 0 Cited by

Patent Information

Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
湖南鸿展自动化设备有限公司
Publication Date
2017-02-01

Smart Images

  • Figure 1
    Figure 1
  • Figure 2
    Figure 2
Patent Text Reader

Abstract

The invention discloses a vertical continuous electroplating device which is used for carrying out vertical continuous electroplating or cleaning on a circuit board. The vertical continuous electroplating device comprises a driving wheel group, a driven wheel group, a first conveyor belt, a second conveyor belt, a conductive guide rail, a rack guide rail, a plurality of first conductive hangers, a second conductive hanger, flexible cables and a rack head, wherein the driving wheel group and the driven wheel group are in transmission connection through the first conveyor belt and the second conveyor belt; the first conductive hangers are electrically connected with the second conductive hanger through the flexible cables; the first conveyor belt and the second conveyor belt are driven, so that the first conductive hangers move along the conductive guide rail; the second conductive hanger moves along the rack guide rail; and the rack head is arranged at one end of the second conductive hanger, and is used for connecting a circuit board. According to the vertical continuous electroplating device, the conductive guide rail does not vibrate when the circuit board vibrates through two separate guide rails of the conductive guide rail and the rack guide rail, so that the problems such as poor contact of the conductive guide rail are avoided; and the electroplating effect is improved.
Need to check novelty before this filing date? Find Prior Art

Description

technical field

[0001] The invention relates to an electroplating device, in particular to a vertical continuous electroplating device. Background technique

[0002] At present, since the printed circuit board is provided with openings, when the printed circuit board is electroplated, air bubbles are likely to exist in the openings, which affects the electroplating effect. In the traditional vertical continuous electroplating process, current is passed through the conductive rail, the hanger head is hung on the conductive rail, and the hanger head is electrically connected to the conductive rail. The hanger head is used for connecting with the circuit board, and is electrically connected with the circuit board. During the electroplating process, if the purpose of removing air bubbles on the circuit board is achieved by vibrating the circuit board, the hanger head will vibrate. The vibration of the hanger head will cause the connection gap of the conductive guide rail to ju...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More