Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Vertical continuous plating device

A vertical continuous electroplating, circuit board technology, applied in the electrolysis process, electrolysis components and other directions, can solve the problems of poor electrical contact of conductive rails, connection gap jumping, affecting the electroplating effect, etc., to achieve the effect of easy maintenance, enhanced effect, and convenient disassembly

Active Publication Date: 2017-02-01
湖南鸿展自动化设备有限公司
View PDF6 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The vibration of the hanger head will cause the connection gap of the conductive guide rail to jump, which will easily cause poor electrical contact of the conductive guide rail and affect the electroplating effect

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Vertical continuous plating device
  • Vertical continuous plating device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0026] In order to facilitate the understanding of the present invention, the present invention will be described more fully below with reference to the associated drawings. Preferred embodiments of the invention are shown in the accompanying drawings. However, the present invention can be embodied in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the disclosure of the present invention more thorough and comprehensive.

[0027] It should be noted that when an element is referred to as being “fixed” to another element, it can be directly on the other element or there can also be an intervening element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "left," "right," and similar expressions are used herein for purposes of ill...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses a vertical continuous electroplating device which is used for carrying out vertical continuous electroplating or cleaning on a circuit board. The vertical continuous electroplating device comprises a driving wheel group, a driven wheel group, a first conveyor belt, a second conveyor belt, a conductive guide rail, a rack guide rail, a plurality of first conductive hangers, a second conductive hanger, flexible cables and a rack head, wherein the driving wheel group and the driven wheel group are in transmission connection through the first conveyor belt and the second conveyor belt; the first conductive hangers are electrically connected with the second conductive hanger through the flexible cables; the first conveyor belt and the second conveyor belt are driven, so that the first conductive hangers move along the conductive guide rail; the second conductive hanger moves along the rack guide rail; and the rack head is arranged at one end of the second conductive hanger, and is used for connecting a circuit board. According to the vertical continuous electroplating device, the conductive guide rail does not vibrate when the circuit board vibrates through two separate guide rails of the conductive guide rail and the rack guide rail, so that the problems such as poor contact of the conductive guide rail are avoided; and the electroplating effect is improved.

Description

technical field [0001] The invention relates to an electroplating device, in particular to a vertical continuous electroplating device. Background technique [0002] At present, since the printed circuit board is provided with openings, when the printed circuit board is electroplated, air bubbles are likely to exist in the openings, which affects the electroplating effect. In the traditional vertical continuous electroplating process, current is passed through the conductive rail, the hanger head is hung on the conductive rail, and the hanger head is electrically connected to the conductive rail. The hanger head is used for connecting with the circuit board, and is electrically connected with the circuit board. During the electroplating process, if the purpose of removing air bubbles on the circuit board is achieved by vibrating the circuit board, the hanger head will vibrate. The vibration of the hanger head will cause the connection gap of the conductive guide rail to ju...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): C25D19/00C25D17/00
Inventor 刘长春
Owner 湖南鸿展自动化设备有限公司
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com