Method for monitoring the stack-up sequence of multi-layer circuit board
A multi-layer circuit board, circuit board technology, applied in the direction of multi-layer circuit manufacturing, printed circuit, printed circuit manufacturing, etc., can solve the problems of low efficiency, poor effect, circuit board damage, etc., to achieve high efficiency, less operation, improved quality effect
Active Publication Date: 2019-04-19
SHENZHEN WUZHU TECH
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Problems solved by technology
[0005] In order to solve the above-mentioned technical problems of poor effect, low efficiency and easy damage to the circuit board itself when detecting the wrong stacking order of the above-mentioned multi-layer circuit board, the present invention provides a fast, efficient, convenient and intuitive method that does not affect the performance of the multi-layer circuit board itself. The method of monitoring the stack-up sequence of multi-layer circuit board
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[0031] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.
[0032] see figure 1 , is a schematic flowchart of a method for monitoring the stacking order of multilayer circuit boards. The method comprises the steps of:
[0033] Step S1, providing a multilayer circuit board to be tested, a detection device for detecting circuit conduction, and an external power supply;
[0034] The multilayer circuit board is slightly larger than the finished circuit board, and includes a plurality of press-fit single-layer circuit boa...
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The invention provides a method for monitoring a wrong stacking sequence of a multilayer circuit board. The method for monitoring the staggered sequence of the multilayer circuit board comprises the following steps of step 1, providing the multilayer circuit board to be detected, a detection device conducted by a detection circuit, and an external power supply, wherein the multilayer circuit board comprises a work circuit board and a detection circuit board with copper foils on different positions; step 2, drilling a plurality of through holes with different depths in the detection circuit board; step 3, connecting two ends of the external power supply with two ends of the detection circuit board respectively; step 4, observing whether the detection device can be normally connected with the detection circuit board or not so as to judge the condition of a stacking sequence of the work circuit board, and removing the detection circuit board after finishing detection, so that no any adverse effect can be caused to a product. The method for monitoring the wrong stacking sequence of the multilayer board provided by the invention has the advantages of quickness, high efficiency, convenience, intuition and the like, and can effectively discover the stacking error of the multilayer circuit board, the product quality is improved, and the outflow of defective products is avoided.
Description
technical field [0001] The invention relates to the technical field of circuit board detection, in particular to a method for monitoring the stacking order of multilayer circuit boards. Background technique [0002] With the development of technology and the upgrading of electronic products, traditional single- and double-sided printed circuit boards can no longer meet the needs of the electronics production industry. High-density, multi-layer printed circuit boards are gradually becoming the development trend of circuit boards. [0003] Generally speaking, a multi-layer circuit board is formed by combining multiple single-layer circuit boards by pressing. The circuit conducts electrical signals through the layer-by-layer circuit boards. In order to ensure the normal transmission of electrical signals, the stacking order of the circuit boards It must be accurate, once an error occurs, there will be a short circuit or open circuit inside the multilayer circuit board, which wi...
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IPC IPC(8): H05K3/46G01R31/02G01R27/02
CPCH05K3/46H05K2203/163
Inventor 徐学军
Owner SHENZHEN WUZHU TECH