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A spin-coating device for coating a solid molten substance on a wafer surface

A technology of surface coating and solid melting, used in devices and coatings for coating liquids on the surface, which can solve problems such as uneven film thickness, achieve good film thickness uniformity, standard layout, and achieve mass production Effect

Inactive Publication Date: 2016-08-17
SHENYANG KINGSEMI CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The device adopts the method of spin coating, which not only solves the problem of uneven film thickness, but also creates convenient conditions for fully automatic production

Method used

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  • A spin-coating device for coating a solid molten substance on a wafer surface
  • A spin-coating device for coating a solid molten substance on a wafer surface
  • A spin-coating device for coating a solid molten substance on a wafer surface

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Embodiment Construction

[0021] The present invention will be described in detail below in conjunction with the accompanying drawings.

[0022] Such as figure 1 , figure 2 As shown, the present invention includes a material carrying tank assembly, a material carrying tank heating device, a nozzle assembly and a rotating mechanism, wherein the material carrying tank heating device is connected with the material carrying tank assembly, the material carrying tank assembly is connected with the nozzle assembly, and the rotating The mechanism is arranged under the loading tank assembly and the nozzle assembly, and corresponds to the nozzle assembly. The wafer is arranged on the rotating mechanism, and the material in the loading tank assembly is heated to a molten state by the loading tank heating device. The material in the molten state is sprayed by the nozzle assembly onto the surface of the wafer which is rotated by the rotating mechanism for coating.

[0023] The loading tank assembly includes a lo...

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Abstract

The invention relates to a device for coating a wafer with wax or a solid melt, particularly a spin coating device for coating a wafer with a solid melt. The spin coating device comprises a material carrying tank assembly, a material carrying tank heating device, a nozzle assembly and a rotation mechanism, wherein the material carrying tank heating device is connected to the material carrying tank assembly, the material carrying tank assembly is connected to the nozzle assembly, the rotation mechanism is disposed below the material carrying tank assembly and the nozzle assembly and is corresponding to the nozzle assembly, and the wafer is disposed on the rotation mechanism. A material in the material carrying tank assembly is heated to be in a melt state by the material carrying tank heating device, and the wafer driven to rotate by the rotation mechanism is sprayed and coated with the material in the melt state by the nozzle assembly, thus achieving coating. The spin coating device is compact in structure, standard in overall arrangement, and capable of achieving fully automatic coating. A spin coating manner is adopted, thus overcoming the problem of nonuniform film thickness and creating convenient conditions for fully-automatic production.

Description

technical field [0001] The invention relates to equipment for coating wax or solid molten substance on the wafer surface, in particular to a spin coating device for coating solid molten substance on the wafer surface. Background technique [0002] At present, static pressure coating is mostly used for wax coating on the wafer surface. This method requires manual placement and collection of wafers, which is not conducive to large-scale automated production, and the film thickness of the pressure coating method is not ideal. Contents of the invention [0003] In view of the above problems, the object of the present invention is to provide a spin coating device for coating a solid molten substance on the surface of a wafer. The device adopts the method of spin coating, which not only solves the problem of uneven film thickness, but also creates convenient conditions for fully automatic production. [0004] In order to achieve the above object, the present invention adopts t...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B05C5/04B05C11/08B05C11/10
CPCB05C5/0208B05C11/08B05C11/1042
Inventor 张杨
Owner SHENYANG KINGSEMI CO LTD
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