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Lead wire connection structure and electronic device including the same

A technology of wire connection and wire, which is applied in the direction of conductive connection, connection components, parts of connection devices, etc., can solve the problems of high material cost, high manufacturing cost, and long processing time, and achieve low manufacturing cost, easy positioning operation, The effect of short processing time

Inactive Publication Date: 2015-04-15
ORMON CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] However, in order to perform the above-mentioned flanging process, the metal material of the conductive part needs to be thick, which not only requires high material cost, but also requires large and expensive manufacturing equipment, and the processing time is long, so there is a problem of high manufacturing cost.

Method used

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  • Lead wire connection structure and electronic device including the same
  • Lead wire connection structure and electronic device including the same
  • Lead wire connection structure and electronic device including the same

Examples

Experimental program
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Embodiment Construction

[0092] Such as Figure 1A to Figure 21B As shown in the accompanying drawings, an embodiment in which the wire connection structure of the present invention is applied to the relay socket 10 is illustrated.

[0093] Such as Figure 1A , Figure 1B As shown, the relay 11 can be installed in a detachable manner on the relay socket 10 of the first embodiment, as figure 2 , image 3 As shown, a plurality of wires 60 are accommodated and arranged in the space formed by the housing 20 and the base 30 .

[0094] Such as figure 2 As shown, the cover 20 is substantially box-shaped, and a plurality of insertion holes 22 are arranged in a grid pattern on the bottom surface of a positioning recess 21 provided in the center of the upper surface. The insertion hole 22 is substantially cross-shaped in plan view, and can insert a contact 70 described later from the lower side.

[0095] In addition, a plurality of insulating walls 23 are formed at predetermined intervals on opposite sid...

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PUM

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Abstract

A lead wire connection structure includes: a terminal including a terminal main body having a through hole, and a connection part extending from one end of the terminal main body; and a lead wire having one end connected to the connection part. Herein, a pair of elastic holding parts extending from both opposite side edges of the terminal main body holds both side surfaces of a nut. Moreover, an internal thread hole of the nut and the through hole are coaxially arranged. The lead wire connection structure is obtained at low manufacturing cost, that is, the lead wire connection structure is obtained in a short processing time at low material cost and manufacturing facility cost.

Description

technical field [0001] The wire connection structure of the present invention relates to, for example, a wire connection structure assembled in a relay socket. Background technique [0002] In the past, a method for manufacturing an electronic component such as a wire connection structure as a relay socket, such as a wire and a conductive part, is disclosed. After the lead-in hole, external pressure is applied to the conductive part to deform the lead-in hole to connect the lead and the conductive part. [0003] In addition, in the above-mentioned method of manufacturing an electronic component, a burring process is performed. In this burring process, the conductive part is subjected to ejection processing and a female screw hole is formed. [0004] Patent Document 1: JP Unexamined Publication No. 2000-100540 [0005] However, in order to perform the above-mentioned flanging process, the metal material of the conductive part needs to be thick, which not only increases the ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01R13/02H01R33/76
CPCH01R4/30F16B37/043H01R13/627H01R4/302H01R13/025H01R33/76H01R33/7685F16B37/044
Inventor 石川义人宫坂岳志塚中阳平
Owner ORMON CORP