Mobile phone cooling device and processing method thereof
A mobile phone heat dissipation and processing method technology, which is applied in the direction of telephone structure, cooling/ventilation/heating transformation, etc., can solve the problems of affecting the cooling effect of mobile phone cooling devices, affecting the cooling efficiency of mobile phone cooling devices, and poor thermal conductivity.
Inactive Publication Date: 2018-03-23
佛山市南海鹰毅五金制品厂
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Problems solved by technology
[0002] The existing mobile phone cooling device includes a base and a top part connected to the top of the base, wherein the base and the top part are aluminum alloy parts, and the heat dissipation efficiency of the mobile phone cooling device is seriously affected due to the poor thermal conductivity of the aluminum alloy.
At the same time, the base and the top part are connected to each other by bonding thermally conductive adhesive. The thermally conductive adhesive can play a role in heat transfer, but after a long time of use, it will age and there will still be a gap between the base and the top part, which will seriously affect the heat dissipation of the mobile phone. The heat dissipation effect of the device; moreover, the use of thermally conductive adhesive also greatly increases the processing cost of the mobile phone heat sink
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[0025] Specific embodiments of the present invention will be described in detail below in conjunction with the accompanying drawings. It should be understood that the specific embodiments described here are only used to illustrate and explain the present invention, and are not intended to limit the present invention.
[0026] In the present invention, unless stated to the contrary, the used orientation words such as "the bottom of the base 2" generally refers to the side of the base 2 opposite to the base 1, and "the top of the base 1" generally refers to The side of base 1 opposite base 2.
[0027] The invention provides a mobile phone cooling device, the mobile phone cooling device such as figure 2 As shown, it includes a base 1 and a top part connected to the top of the base 1, the top part is as figure 1 As shown, it includes a base 2 for connecting with the base 1, the bottom of the base 2 is formed with one of the slot and the block, and the top of the base 1 is corre...
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The invention discloses a mobile phone cooling device and a processing method thereof. The mobile phone cooling device includes a base (1) and a top part connected to the top of the base (1). 1) A connected base (2), the bottom of the base (2) is formed with one of the slot and the block, and the top of the base (1) is correspondingly formed with the other of the slot and the block One, the block is embedded in the slot, so that the base (2) and the base (1) are connected to each other, and the top part is a copper alloy part, and the base (1) For aluminum alloy parts. The cooling effect of the mobile phone cooling device is good, and at the same time, the processing method of the mobile phone cooling device has simple steps and low production cost.
Description
technical field [0001] The invention relates to a mobile phone cooling device, in particular to a mobile phone cooling device and a processing method thereof. Background technique [0002] The existing mobile phone cooling device includes a base and a top part connected to the top of the base, wherein the base and the top part are aluminum alloy parts, and the poor thermal conductivity of the aluminum alloy seriously affects the heat dissipation efficiency of the mobile phone cooling device. At the same time, the base and the top part are connected to each other by bonding thermally conductive adhesive. The thermally conductive adhesive can play a role in heat transfer, but after a long time of use, it will age and there will still be a gap between the base and the top part, which will seriously affect the heat dissipation of the mobile phone. The cooling effect of the device; moreover, the use of thermally conductive adhesive also greatly increases the processing cost of th...
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IPC IPC(8): H04M1/02H05K7/20
Inventor 刘文华
Owner 佛山市南海鹰毅五金制品厂