Method for replacing backdrill copper removal process

Abstract

The invention provides a method for replacing a backdrill copper removal process. The method includes providing a printed circuit board, and drilling the printed circuit board to form a through hole; electroplating the through hole of the printed circuit board after the through hole is drilled to form a metal layer; filling the through hole of the printed circuit board where the metal layer is formed with ink; utilizing a plate grinding machine for grinding to grind off the ink protruding out of a through hole port; pasting a dry film in a copper plated surface area, needless of copper removal, of the printed circuit board with the through hole and after being electroplated, and exposing an area of 3-6mil larger than a single side of the through hole by the dry film; providing an etching line to etch the printed circuit board; repeating the etching step to remove metal filings left in the through hole. The method is high in copper removal efficiency, working process is easy to control, and quality of the printed circuit board is guaranteed.

Description

technical field [0001] The invention relates to the field of printed circuit board manufacture, in particular to a process method for replacing back-drilling to remove copper. Background technique [0002] With the rapid development of wireless and network communication technologies, the operating frequency of communication products is getting higher and higher, and the increase in operating frequency of communication products puts forward higher requirements for loss control in the transmission process. Printed circuit boards are the physical support of electronic products and an important part of signal transmission. [0003] A section of the metallized hole in the printed circuit board is not used for signal transmission, and the useless copper part of the hole will increase the loss of signal transmission in the printed circuit board, and even destroy the integrity of signal transmission, so back drilling is often used in the industry as much as possible. It is possible...

AI Technical Summary

Problems solved by technology

[0010] In order to solve the technical problems of low back-drilling efficiency, difficulty in controlling the depth, difficulty in controlling the quality, and changes in the aperture diameter of the above-mentioned printed circuit board back-drilling process for removing copper, the present invention provides a high-efficiency, controllable depth, controllable quality, The process method of replacing back-drilling and removing copper without changing the hole diameter

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