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Processing device and device manufacturing method

A processing device and a technology for holding parts, which can be used in photo-engraving process exposure devices, instruments, photo-engraving process of pattern surface, etc., and can solve problems such as reduction of exposure accuracy.

Active Publication Date: 2017-03-08
NIKON CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In this way, if the projection area and the illumination area are not parallel to each other, the accuracy of exposure will be reduced

Method used

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  • Processing device and device manufacturing method
  • Processing device and device manufacturing method
  • Processing device and device manufacturing method

Examples

Experimental program
Comparison scheme
Effect test

no. 1 Embodiment approach

[0037] figure 1 It is a figure which shows the structural example of a device manufacturing system SYS (flexible display production line). Here, an example is shown in which the flexible substrate P (sheet, film, etc.) drawn out from the supply roll FR1 passes through n processing units U1, U2, U3, U4, U5, .

[0038] figure 1 In the XYZ rectangular coordinate system, the front surface (or back surface) of the substrate P is set to be perpendicular to the XZ plane, and the direction (width direction) perpendicular to the conveyance direction (longitudinal direction) of the substrate P is set to be as the Y-axis direction. For example, the Z-axis direction is set as a vertical direction, and the X-axis direction and Y-axis direction are set as horizontal directions.

[0039] The board|substrate P wound up by the supply roller FR1 is drawn out by the drive roller DR1 which pinches this, and is conveyed to the processing apparatus U1. The center of the substrate P in the Y-axi...

no. 2 Embodiment approach

[0118] Next, a second embodiment will be described. In this embodiment, the same reference numerals are assigned to the same configurations as those in the above-mentioned embodiment, and descriptions thereof are simplified or omitted.

[0119] Figure 6 as well as Figure 7 It is a perspective view which shows the exposure apparatus EX of this embodiment. Figure 7 is from with Figure 6 Views from different viewpoints. This exposure apparatus EX is a so-called multi-lens type exposure apparatus, and is equipped with the some projection module PM lined up in the non-scanning direction (Y-axis direction) perpendicular|vertical to a scanning direction (X-axis direction). The exposure apparatus EX can expose a wider exposure area than the case where the number of projection modules PM is one by linking areas (exposure areas) on the substrate P that are respectively exposed by a plurality of projection modules PM in the Y-axis direction. .

[0120] Figure 6 The shown plur...

no. 3 Embodiment approach

[0147] Next, a third embodiment will be described. In this embodiment, the same reference numerals are assigned to the same configurations as those in the above-mentioned embodiment, and descriptions thereof are simplified or omitted. Figure 10 It is a figure which schematically shows the exposure apparatus EX of this embodiment, and illustration of 2nd projection optical system PL2 etc. is abbreviate|omitted. Figure 10 The structure of the illumination system IU of the exposure apparatus EX differs from the said embodiment.

[0148] The illumination system IU includes a light guide rod 51 for guiding (transmitting) illumination light from a light source to the illumination optical system 21 . Figure 10 The light guide rod 51 is a cylindrical member substantially parallel to the rotation center axis AX1 of the rotary drum DM (here, substantially coaxial). The light guide rod 51 is formed to reflect light on its inner surface. The light guide rod 51 guides the light in a ...

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Abstract

A processing apparatus (EX) projects and exposes a pattern formed in a mask pattern (M) to a substrate (P). The processing apparatus is provided with: a mask holding member (DM) that holds the mask pattern in a bent state; a substrate supporting member (DP) that supports the substrate; a lighting system (IU) that lights a part of the mask pattern; an intermediate image forming optical system (PL1), which forms an intermediate image (IM) corresponding to a lighting region (IR) formed on the mask pattern by means of the lighting system, and which brings the tangential plane (IMa) of the intermediate image and the tangential plane (IRa) of the lighting region on the mask pattern into a conjugate relationship by satisfying shine-proof conditions; and a projection optical system (PL2), which projects the intermediate image to a projection region (PR) on the substrate supported by means of the substrate supporting member.

Description

technical field [0001] The invention relates to a processing device and a device manufacturing method. [0002] This application claims the priority of Japanese Patent Application No. 2012-173982 for which it applied on August 6, 2012, and uses the content here. Background technique [0003] In recent years, as display devices such as televisions, for example, flat panel displays such as liquid crystal display panels have been widely used. Various devices such as flat panel displays are manufactured by forming various film patterns such as transparent thin-film electrodes on substrates such as glass plates using exposure processing and etching techniques, for example. [0004] The exposure process described above is performed, for example, by transferring an image corresponding to an illumination area set on a mask pattern on which an exposure pattern is formed, to a projection area provided on a substrate. As an exposure apparatus that performs such an exposure process, f...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G03F7/20G03F7/24
CPCG03F7/24G03F7/70833
Inventor 小松宏一郎
Owner NIKON CORP