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led circuit

A technology of LED circuit and LED packaging, which is used in circuits, electric light sources, electrical components, etc.

Active Publication Date: 2017-08-25
LUMILEDS HLDG BV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] It is also known that, in addition to ESD protection, by associating LEDs with control transistors, it is possible to drive and control LED strings

Method used

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Embodiment Construction

[0029] The present invention provides an LED circuit comprising integrated circuit LEDs, each integrated circuit LED mounted on a corresponding LED control circuit. The LED control circuits are electrically connected together to define strings of LED control circuits, each LED control circuit having at least one control line leading to the circuit. This provides a compact circuit of multiple LEDs with individual control of the LEDs.

[0030] figure 1 A known LED package is shown. The LED 10 is formed as a discrete package mounted on a silicon substrate 12, eg, by solder balls. Connections to the LED package are made through solder balls and external connections from the substrate are made through wire bonds 14 . Such as figure 1 As shown schematically in , the substrate 12 may implement a pair of ESD protection diodes. Thus, ESD protection is one reason to associate additional components with each LED.

[0031] Another reason to associate an additional component with eac...

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Abstract

An LED circuit (40) includes integrated circuit LEDs (50) each mounted on a corresponding LED control circuit (42). The LED control circuits (42) are electrically connected together by an integrated circuit to define a string of LED control circuits, each LED control circuit having at least one control line (44) leading to the circuit. This provides a compact circuit of multiple LEDs with individual control of the LEDs.

Description

technical field [0001] The present invention relates to LED circuits, eg, formed as discrete LED packages connected to associated circuitry. Background technique [0002] Various LED packages are known. For example, wafer-level chip-scale LED packages are known which can be soldered directly onto a suitable substrate. Such packages typically have two contacts to the p-n junction of the diode. The LED package may eg be mounted to a substrate carrying control circuitry for the LED eg ESD diodes or control transistors. [0003] By way of example, LED dies may be mounted on a silicon substrate, where the substrate contains embedded ESD protection diodes. Contacts on the top of the substrate make electrical connections to the LED die terminals, and the substrate has additional external contacts on the same top surface outside the area where the LED dies are mounted. [0004] It is also known that, in addition to ESD protection, it is possible to drive and control LED strings ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05B33/08H05B44/00
CPCH01L2224/16145H01L2224/48463H01L2224/73253H05B45/48H01L23/5386H01L25/167
Inventor J.A.舒格
Owner LUMILEDS HLDG BV