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Communication connecting method and system

A technology of communication connection and interconnection, applied in the field of communication, can solve the problems of high requirements for CPU board material, low QPI topology variability, relatively high requirements for CPU board thickness and PCB layer number, etc.

Inactive Publication Date: 2015-04-22
INSPUR BEIJING ELECTRONICS INFORMATION IND
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0008] 1. The material requirements for the CPU board are relatively high and the cost is high;
[0009] 2. The thickness of the CPU board and the number of PCB layers are also relatively high;
[0010] 3. The wiring requirements are relatively high;
[0011] 4. QPI topology variability is not strong

Method used

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  • Communication connecting method and system

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Embodiment Construction

[0028] Hereinafter, the present invention will be described in detail with reference to the drawings and in conjunction with the embodiments. It should be noted that the embodiments in the application and the features in the embodiments can be combined with each other if there is no conflict.

[0029] figure 2 Shown is a schematic structural diagram of the communication connection system of the present invention, including CPU0, CPU1, CPU2, and CPU3; CPU0 includes QPI (Quick Path Interconnect) port 1, QPI port 2, and QPI port 0; CPU1 includes QPI port 1, QPI port 2, QPI port 0; CPU2 includes QPI port 1, QPI port 2, and QPI port 0; CPU3 includes QPI port 1, QPI port 2, and QPI port 0.

[0030] QPI port 2 of CPU0 is connected to QPI port 1 of CPU1; QPI port 2 of CPU1 is connected to QPI port 1 of CPU2; QPI port 2 of CPU2 is connected to QPI port 1 of CPU3; QPI port 2 of CPU3 is connected to QPI port 1 of CPU0 Connection (that is, the QPI port 1 and port 2 of the 4 CPUs are connecte...

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PUM

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Abstract

The invention provides a communication connecting method and system. The communication connecting method includes the following steps: CPUs in a preset number are arranged on a CPU board card; the CPUs are connected through first ports and second ports, wherein each CPU comprises the first port, the second port and a third port; the third ports of the CPUs are connected with an input and output board card, namely an IO board card through orthogonal connectors, the CPU efficiency is played to the maximum degree, and the PCB cost is reduced. The communication connecting method and system further have the advantages that the relatively-high convenience and the relatively-high practicality are achieved, convenience is brought to operation, and the QPI topology variability is high; the requirement for materials of the CPU board card is lower than the requirement for materials of a common CPU board card, and therefore the cost is reduced; the requirements for the board thickness of the CPU board card and the number of layers of the CPUs are reduced; the wiring requirement is reduced.

Description

Technical field [0001] The invention belongs to the field of communication, and particularly relates to a communication connection method and system. Background technique [0002] With the continuous development of network technology, major network companies, governments, financial institutions, etc. have generated greater demand for servers. Controlling production costs in the server development and production process has become an issue that server manufacturers have to consider. [0003] In terms of controlling the production cost, the material cost of PCB (Printed Circuit Board) is a major problem restricting manufacturers. In the PCB board design, it is necessary to save material costs and maximize the efficiency of the CPU on it, which objectively makes it difficult to achieve both. [0004] Such as figure 1 As shown, the CPU board includes CPU0, CPU1, CPU2, and CPU3; CPU0 includes QPI (Quick Path Interconnect) port 1, QPI port 2, and QPI port 0; CPU1 includes QPI port 1, QPI ...

Claims

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Application Information

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IPC IPC(8): G06F13/38
CPCG06F13/409
Inventor 张志安叶丰华
Owner INSPUR BEIJING ELECTRONICS INFORMATION IND
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