High-speed assembling process for metal and adhesive

Abstract

The invention discloses a high-speed assembling process for metal and adhesive; the process comprises a metal strap and an adhesive tape; the metal strap and the adhesive tape are crossed and pulled by pullers; the puller on the adhesive tape is a first puller and the puller on the metal strap is a second puller; the middle parts of the adhesive tape and the metal tape are overlapped; the overlapped part forms a pin guide position which matches with a guide pin on a mould to guide the positions of the metal strap and the adhesive tape. With adoption of the guiding, the compounding efficiency and yield rate are directly improved; the traditional manual compounding is updated to automatic high-speed and stable compounding for metal and adhesive compounded parts; the industry is updated and the considerable economic benefit is brought to enterprises.

Description

technical field [0001] The invention relates to a high-speed assembly process of metal and glue. Background technique [0002] Metal and glue are two different materials. Their chemical structure and mechanical properties are very different. With the help of metal and glue bonding, the two materials can be combined into a compound with different configurations and characteristics that people need. Components, this technology has contributed to the revolution in the field of materials, such as automobiles, electronics, mechanical manufacturing and other fields are widely used. Electronic products often use small parts that combine glue and metal parts, such as conductive glue, foam, adhesive glue and metal composites, etc., to meet product functional requirements. The conventional assembly process is to use simple fixtures to divide the glue into multiple layers and assemble them with metal respectively, but the efficiency and accuracy of the compounding are relatively low, ...

AI Technical Summary

Problems solved by technology

The conventional assembly process is to use simple fixtures to divide the glue into multiple layers and assemble them with metal, but the efficiency and accuracy of the compounding are relatively low, and it is difficult to match the short production cycle and large demand of electronic products.

[0003] The product structure in the existing technology is unstable and the precision is poor; the production capacity is low, and it is difficult to meet the demand when the volume is increased; the labor cost is high

[0004] In actual operation,

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