Processing device

Abstract

The invention provides a processing device, which can measure the processed area without taking out a processed article from the processing device after processing. The processing device comprises a measuring member which can measure the processed area of a processed article after processing. The measuring member is characterized by comprising a three-dimensional measuring member, which can measure a processed article in the X axis direction, the Y axis direction, and the Z axis direction and obtains shape information, wherein the X axis, Y axis, and Z axis are perpendicular to each other; and a processing member, which can process the information obtained by the three-dimensional measuring member and generates image information. The processing member comprises an image information generating part, which generates image information according to the Z coordinate stored in the Z coordinate storage part and the X-Y coordinates stored in the X-Y coordinate storage part; and a calculating part which can calculate the measure value of a processed article according to the generated image information. Through the processing device, a processed article can be measured without being taken out of the processing device.

Description

technical field [0001] The present invention relates to processing devices such as laser processing devices and cutting devices. Background technique [0002] Wafers such as silicon wafers and sapphire wafers, which are divided by dividing lines and have IC (Integrated Circuit: Integrated Circuit), LSI (Large Scale Integration: Large Scale Integration) and LEDs formed on the surface, are divided by processing equipment The separated devices are widely used in various electronic devices such as mobile phones and computers. [0003] For dividing wafers, a dicing method using a cutting device called a dicing machine is widely used. In the dicing method, the cutting blade is cut into the wafer while rotating at a high speed of about 30,000 rpm to cut the wafer, and the wafer is divided into individual devices. The cutting blade is fixed with abrasive grains such as diamond by metal or resin. Instead, it is formed to have a thickness of about 30 μm. [0004] On the other hand,...

AI Technical Summary

Problems solved by technology

[0009] However, the image captured by the imaging device equipped with a microscope and a camera is a two-dimensional image, and the width or depth of the processing groove formed by cutting or laser processing, and the height or width of the chip can only be roughly measured, and it cannot be measured in the device. Detect the cross-sectional shape of the machining groove and the volume of chips

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