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A kind of ku band power amplifier

A power amplifier and ku-band technology, applied in the field of Ku-band power amplifiers, can solve problems such as the limitation of the number of solid-state devices and the inability to meet the transmission power requirements of scattering communication, and achieve the advantages of facilitating multi-module power synthesis, reducing assembly relations, and improving heat dissipation efficiency Effect

Active Publication Date: 2017-09-29
NO 54 INST OF CHINA ELECTRONICS SCI & TECH GRP
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At present, the power amplifiers widely used in the Ku frequency band of the scatter communication system are mostly planar circuit synthesis. Due to the transmission line loss and the circuit structure increasing non-linearly with the increase of the number of devices, the number of solid-state devices that can be synthesized is limited, which cannot meet the requirements of scatter communication. Transmit power requirements

Method used

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  • A kind of ku band power amplifier
  • A kind of ku band power amplifier
  • A kind of ku band power amplifier

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Embodiment Construction

[0021] The present invention will be further described in detail below in conjunction with the accompanying drawings and specific embodiments.

[0022] figure 1 It is a schematic diagram of a split structure of a Ku-band power amplifier of the present invention, figure 2 It is a sectional view of the power amplifier of the present invention. The present invention is a Ku-band power amplifier, comprising an upper box body 1, a middle box body 3 and a lower box body 5. The upper box body 1 is equipped with an upper power amplifier printed board 2, and the lower box body The lower power amplifier printed board 6 is installed in the body 5, and the upper box body 1, the middle box body 3 and the lower box body 5 are sequentially buckled to form a closed rectangular input waveguide and a rectangular output waveguide, and the waveguide input and output ports 4 receive external radio frequency signals.

[0023] image 3 It is the PCB diagram of the power amplifier printed board of...

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Abstract

The invention discloses a Ku-band power amplifier, which comprises an upper box body, a lower box body and a middle box body; power amplifier printed boards are respectively installed on the upper box body and the lower box body; the middle box body is provided with an isolation cavity; The board is equipped with input pair of fin lines, input anti-resonance tuning block, power amplifier unit, output pair of fin lines and output anti-resonance tuning block, the microstrip output end of the input pair of fin lines is connected to the input end of the power amplifier unit, and the output pair of fin lines The input end of the microstrip is connected with the output end of the power amplifier unit. The invention realizes the integration of input power distribution, power amplification and output power synthesis by adopting three-dimensional assembly of circuits. The present invention is integrally processed and integrally formed, which reduces the influence of human factors on assembly, reduces the assembly process, improves the quality of equipment, and enhances the stability of the system.

Description

technical field [0001] The invention relates to a Ku-band power amplifier in the communication field, in particular to a Ku-band 40W power amplifier, which is especially suitable for a transmission device for completing radio frequency signal power amplification in a transmission channel of a Ku-band communication system. Background technique [0002] With the development of scattering communication technology, the requirements for the transmission power of the Ku-band communication system are increasing. At present, the power amplifiers widely used in the Ku frequency band of the scatter communication system are mostly planar circuit synthesis. Due to the transmission line loss and the circuit structure increasing non-linearly with the increase of the number of devices, the number of solid-state devices that can be synthesized is limited, which cannot meet the requirements of scatter communication. Transmit power requirements. Contents of the invention [0003] The techn...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H03F3/20H03F1/00
Inventor 杨作成张志忠王晓龙张静李楠朱秀敏王晓明杨贺
Owner NO 54 INST OF CHINA ELECTRONICS SCI & TECH GRP
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