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Camera module

A camera module and image sensing technology, which is applied in image communication, TV, color TV parts, etc., can solve the problems of large height, unsuitable thinness, and shortness, and achieve the effect of sufficient wiring space and reduced height

Inactive Publication Date: 2015-04-29
NANCHANG O FILM OPTICAL ELECTRONICS TECH CO LTD +3
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The height of this traditional camera module is relatively large, which cannot meet the requirements of thinness and shortness

Method used

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Embodiment Construction

[0022] In order to make the above objects, features and advantages of the present invention more comprehensible, specific implementations of the present invention will be described in detail below in conjunction with the accompanying drawings. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention. However, the present invention can be implemented in many other ways different from those described here, and those skilled in the art can make similar improvements without departing from the connotation of the present invention, so the present invention is not limited by the specific implementations disclosed below.

[0023] The terms "vertical," "horizontal," "left," "right," and similar expressions are used herein for purposes of illustration only and are not intended to represent the only embodiments.

[0024] Unless otherwise defined, all technical and scientific terms used herein have the same...

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Abstract

A camera module comprises a first reinforcement plate, a flexible substrate, an image sensing chip and a plurality of conductive leads, wherein the flexible substrate comprises a single-sided flexible printed circuit board and a double-sided flexible printed circuit board which form a flexible printed circuit board with a multi-layer structure, and sufficient wiring space is guaranteed accordingly; a groove is formed in a mounting surface of the flexible substrate and penetrates through the single-sided flexible printed circuit board, and a plurality of first welding pads are arranged in the groove; a plurality of second welding pads are arranged on the image sensing chip; one end of each conductive lead is connected with one first welding pad, and the other end is connected with one second welding pad, so that the image sensing chip is electrically connected with the flexible substrate; further, a through hole is formed in the flexible substrate and penetrates through the mounting surface and a back side of the flexible substrate, and the image sensing chip is arranged in the through hole. The total height after the image sensing chip is assembled with the flexible substrate is smaller than the height sum of the image sensing chip and the flexible substrate, so that the height of the camera module can be reduced effectively, and the development requirement for light, thin, short and small tendency day by day can be met.

Description

technical field [0001] The invention relates to the technical field of camera equipment, in particular to a camera module. Background technique [0002] With the continuous development of technology, the camera module not only needs to meet higher camera functions, but also tends to be thinner and shorter. The thinness and shortness of the camera module are one of the important factors affecting the lightness and thinness of mobile terminal camera equipment such as mobile phones. Therefore, it is particularly important to improve the structure of the camera module and develop in a direction that is conducive to the lightness and thinness of mobile terminal camera equipment such as mobile phones. [0003] A traditional camera module is usually composed of a lens, a lens support component, a sensor photosensitive device and a circuit board. The total height of the camera module = the optical length of the lens (TTL, Total Track Length) + the height of the sensor photosensitiv...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H04N5/225
Inventor 刘燕妮王昕雷光辉
Owner NANCHANG O FILM OPTICAL ELECTRONICS TECH CO LTD
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