a cooling device
A technology of a heat dissipation device and a heat dissipation fin, applied in the field of communication, can solve the problems of low heat dissipation effect and large temperature difference between the upper and lower surfaces of a heat transfer substrate, and achieve the effect of avoiding temperature difference and shortening heat transfer time.
Inactive Publication Date: 2018-03-27
HANGZHOU HUAWEI DIGITAL TECH
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Problems solved by technology
However, there is currently a problem that the temperature difference between the upper and lower surfaces of the heat transfer substrate is relatively large, resulting in a low heat dissipation effect.
Method used
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Embodiment Construction
[0023] The invention provides a heat exchange plate, a heat exchanger and a cabinet of a communication base station.
[0024] In order to make the purpose, features and advantages of the present invention more obvious and understandable, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the following The described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.
[0025] The terms "first", "second", "third", "fourth", etc. (if any) in the description and claims of the present invention and the above drawings are used to distinguish similar objects and not necessarily Describe a pa...
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An embodiment of the present invention provides a heat dissipation device, which is used to be arranged between an electronic device and a heat dissipation fin assembly, so as to transfer heat from the electronic device to the heat dissipation fin assembly to dissipate heat from the electronic device. The heat dissipation device includes a substrate and a heat pipe embedded in the substrate, the top surface of the substrate is used to install the heat dissipation fin assembly, the bottom surface of the substrate is used to be installed on the electronic device, and the heat pipe includes A first surface and a second surface oppositely arranged, the first surface is on the same plane as the top surface of the substrate to be in contact with the heat dissipation fin assembly, the second surface is on the same plane as the bottom surface of the substrate The flat surface is in contact with the electronic device, so as to transfer the heat of the electronic device to the heat dissipation fin assembly. The present invention achieves the purpose of reducing or avoiding the temperature difference between the top surface and the bottom surface of the substrate.
Description
technical field [0001] The invention relates to the technical field of communications, in particular to a heat dissipation device. Background technique [0002] With the continuous development of the electronic information industry, the operating frequency and speed of electronic components (especially the central processing unit) are constantly increasing, and the heat generated by them is increasing, which makes their temperature continue to rise, which seriously threatens the performance of electronic components during operation. To ensure the normal operation of electronic components, it is necessary to remove a large amount of heat generated by electronic components in time. At present, heat transfer substrates and radiators are usually used to dissipate heat from electronic components. Specifically, the heat transfer substrate is installed on the electronic components, and the heat sink is arranged on the heat transfer substrate, then the heat on the electronic compon...
Claims
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IPC IPC(8): H05K7/20
Inventor 张军陆贞肖恒
Owner HANGZHOU HUAWEI DIGITAL TECH