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LGA socket device, integrated circuit chip assembly and corresponding method

A technology for integrated circuits and assemblies, which is applied in the field of integrated circuit chip assemblies, can solve problems such as pressure plate heat dissipation paste pollution, high manufacturing costs, and damage to socket pins, and achieve simple costs and reduce the risk of damage to socket pins.

Inactive Publication Date: 2015-05-06
格芯公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The main disadvantage of this solution is the higher manufacturing cost, which has increased by about 50%; in addition, this solution cannot automatically remove the PnP cover, and the PnP cover still needs to be removed manually, and there is still a risk of damaging the socket pins at this time; in addition , since thermal paste is usually applied to the processor after it is installed in the socket, the pressure plate can become contaminated with thermal paste after the processor is removed from the socket

Method used

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  • LGA socket device, integrated circuit chip assembly and corresponding method
  • LGA socket device, integrated circuit chip assembly and corresponding method
  • LGA socket device, integrated circuit chip assembly and corresponding method

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Embodiment Construction

[0023] Embodiments of the present invention will now be described with reference to the accompanying drawings. It should be pointed out that in the drawings and the following description the numerous features are given which are illustrative and exemplary only and not restrictive of the invention. In some embodiments of the invention, some of these features may not be included, or other features not shown and described may be included.

[0024] In one aspect of the present invention, an LGA socket device for preventing damage to terminals of the LGA socket is provided, which includes: an LGA socket and an integrated circuit chip assembly.

[0025] Referring now to Figure 2A and Figure 2B , wherein Fig. 2A shows a top view of an existing LGA socket, Figure 2B Shown are a top view of an LGA socket according to an embodiment of the present invention, and cross-sectional views at position A-A and position B-B. As shown in Figures 2A and 2B, compared with the existing LGA socket...

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Abstract

A land grid array (LGA) socket apparatus includes an LGA socket, with two guide rails provided respectively on the inner sides of two opposite side walls of the socket. The height of the top surface of each guide rail from the socket's bottom is greater than the height of socket terminals from the socket's bottom. The length of each guide rail is smaller than the length of the sidewall's inner side. The guide rails support at least two protrusions provided at corners at opposite sides of an integrated circuit chip assembly when the assembly is slid into the socket from a side. The guide rails, when the assembly is slid to the end of the guide rail, enable the at least two protrusions to fall into the gaps between the ends of the guide rail and the respective socket end walls to install the assembly in the socket.

Description

technical field [0001] The invention relates to the assembly of an integrated circuit chip on a printed circuit board, in particular to a land grid array (LGA, Land Grid Array) socket device, an integrated circuit chip assembly matched therewith and a corresponding method. Background technique [0002] Land grid array (LGA) sockets have been used for many years to provide electrical and mechanical connections between processors and printed circuit boards (PCBs) in PCs or servers. The LGA socket has an array of small, usually copper, spring pins (or terminals) (the spring pins are electrically connected to the PCB), while the processor has a corresponding grid of lands on the underside that when the processor is mounted on When on an LGA socket, the land grid array presses against the array of spring pins to form a reliable electrical connection. [0003] FIG. 1 shows a schematic diagram of a typical existing LGA socket device. As shown in the figure, the LGA socket device ...

Claims

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Application Information

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IPC IPC(8): H01R13/629H01R33/76
CPCH05K7/1061
Inventor 梁云林原黄森雄
Owner 格芯公司