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Cutting fixture and cutting device
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A technology of fixing device and cutting device, applied in metal processing, conductive adhesive and other directions, can solve problems such as affecting the service life of the cutter, affecting the cutting accuracy of the conductive adhesive 100, and the direction of the cutter blade being deflected.
Active Publication Date: 2016-08-03
BOE TECH GRP CO LTD +1
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[0004] However, since the cutting pad 02 is fixed on the support 01, when the cutter fixing module 03 moves upwards to cut the conductive adhesive 100, the cutting pad 02 will suddenly be subjected to the cutting force of the cutter, which may cause the cutting edge of the cutter The direction is deflected, which affects the cutting accuracy of the conductive adhesive 100. In addition, the long-term frequent application of cutting force to the cutting pad 02 by the cutter will affect the service life of the cutter
Method used
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Embodiment 1
[0038] like figure 2 As shown, a cutting and fixing device 01 is provided for an embodiment of the present invention.
[0039] Specifically, such as figure 2 As shown, the cutting and fixing device 01 includes a bracket 11 and a cutting pad 12 , and the bracket 11 is connected to the cutting pad 12 through a buffer mechanism 13 .
[0040] Wherein, when the cutting mat 12 is subjected to cutting force and moves toward the direction close to the support 11, the buffer mechanism 13 can generate a force that slows down the movement of the cutting mat 12, figure 2 The direction of the middle arrow is the direction of the cutting force.
[0041] Specifically, the cutting mat 12 is used to fix the material to be cut (such as the conductive adhesive 100), and when the cutter cuts the conductive adhesive 100, a cutting force perpendicular to the cutting mat 12 will be generated, because between the support 11 and the cutting mat 12 If a buffer mechanism 13 is provided, then, when...
Embodiment 2
[0061] like Figure 8 As shown, the embodiment of the present invention provides a cutting device 02, which includes the cutting fixture 01 and the cutter support 03 as described in Embodiment 1.
[0062] Wherein, the cutter support 03 is opposite to the second plane 1201 of the cutting mat 12 in the cutting fixture 01, and the second plane 1201 of the cutting knife support 03 is opposite to the cutting mat 12. A cutter 300 is provided on the plane.
[0063] Specifically, the cutter bracket 03 reciprocates under the cutting fixture 01 when cutting the conductive adhesive, and when the cutter bracket 03 moves in a direction close to the cutting fixture 01, the cutter bracket 03 drives the cutter 300 The conductive adhesive 100 fixed in the first fixing groove 1202 is cut to complete the task of cutting the conductive adhesive 100 .
[0064] Further, as Figure 9 As shown, the plane on which the cutter 300 is provided on the cutter bracket 03 is also provided with a second li...
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Abstract
The invention relates to the technical field of drive mechanisms, in particular to a cutting and fixing device and a cutting device. Cutting precision of conductive adhesive can be improved to a certain extent, and service life of a cutter is prolonged. The cutting and fixing device comprises a bracket and a cutting cushion block, the bracket and the cutting cushion block are connected through buffer mechanisms, and when the cutting cushion block bears cutting force to move towards the direction close to the bracket, the buffer mechanisms can generate force for slowing down movement of the cutting cushion block. The cutting and fixing device and the cutting device are used for cutting to-be-cut materials.
Description
technical field [0001] The invention relates to the technical field of transmission mechanisms, in particular to a cutting and fixing device and a cutting device. Background technique [0002] Conductive adhesive is an adhesive with certain conductivity after curing or drying, for example, ACF (anisotropic conductive films, anisotropic conductive adhesive), etc. The conductive adhesive contains conductive particles, so it can form a conductive path to realize the adhesion of the adhered material. Therefore, the conductive adhesive is widely used in the TFT-LCD (ThinFilmTransistor-LiquidCrystalDisplay, thin film field effecttransistorliquid crystal display) industry. [0003] With the rapid development of TFT-LCD technology, all kinds of TFT-LCD products have higher and higher requirements for the cutting precision of conductive adhesive. like figure 1 As shown, it is a cutting device for conductive adhesive commonly used at present. The device is mainly composed of a bra...
Claims
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Application Information
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