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Computer control substrate with high-efficiency heat stratification

A technology for controlling substrates and computers, which is applied in the direction of using electric means for temperature control, etc., which can solve the problem that the substrate cannot quickly dissipate heat.

Inactive Publication Date: 2015-05-20
XIAN HANWEI CNC EQUIP LIMITED
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0002] In the construction of semiconductor substrate materials, it is because the general processing box can be arranged in the construction cycle to ensure that the substrate is within a reasonable heat dissipation range. In other construction methods, especially in places that require real-time heat dissipation from the base, this cannot meet the requirements

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  • Computer control substrate with high-efficiency heat stratification

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Embodiment Construction

[0009] The present invention will be further described below by specific embodiment:

[0010] Such as figure 1 As shown, the thermal stratification high-efficiency computer control substrate includes a silicon material square plate 3 with a top end 1 and a bottom end 2 on the base, and the silicon material square plate 3 contains a metal probe 4 attached to the silicon material square plate 3 in order to construct a magnet. The energy is installed on the partition plate 5 of the silicon material square plate 3 , and an electronic temperature booster 6 is embedded inside the silicon material square plate 3 . The electronic warmer 6 is controlled by an external computer.

[0011] The working principle of the present invention is to confirm that the base has a silicon material square plate 3 with a top end 1 and a bottom end 2. The silicon material square plate 3 contains a metal probe 4 attached to the silicon material square plate 3 in order to construct magnetic energy. In a...

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Abstract

The invention discloses a computer control substrate with high-efficiency heat stratification. The computer control substrate comprises a silicon square plate whose base is provided with a top end and a bottom end; the silicon square plate comprises metal probes attached in the silicon square plate and a division plate arranged on the silicon square plate for constructing magnetic energy; an electronic temperature riser is embedded in the silicon square plate; and the electronic temperature riser is externally connected with a computer for control. The defect that particularly, situations in which base heat is required to be radiated in real time can not be met can be effectively avoided.

Description

technical field [0001] The invention belongs to the technical field of computer devices, and in particular relates to a thermal stratification high-efficiency computer control substrate. Background technique [0002] In the construction of semiconductor substrate materials, it is because the general processing box can be arranged in the construction cycle to ensure that the substrate is within a reasonable heat dissipation range. In other construction methods, especially in places where the base heat is required to be dissipated in real time, this cannot meet the requirements. Contents of the invention [0003] The invention provides a heat layered high-efficiency computer control substrate, which includes a silicon square plate with a top end and a bottom end on the base. The silicon material square plate contains a metal probe attached to the silicon material square plate to construct magnetic energy. The partition of the square plate is made of silicon material, and ...

Claims

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Application Information

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IPC IPC(8): G05D23/19
Inventor 曹敏琪
Owner XIAN HANWEI CNC EQUIP LIMITED
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