Solder Bridging Stop Structures for Circuit Substrates and Semiconductor Packages
A semiconductor and substrate technology, applied in semiconductor devices, semiconductor/solid-state device components, circuits, etc., can solve problems such as high complexity, increased substrate and packaging costs
Active Publication Date: 2017-10-13
INFINEON TECH AG
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- Summary
- Abstract
- Description
- Claims
- Application Information
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Problems solved by technology
However, this conventional approach has limited effectiveness in terms of bending reduction
Furthermore, the complexity involved in arriving at an optimal solution is very high, e.g. due to the variability of possible substrate designs between different users, which in turn raises the cost of the substrate and packaging
Method used
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Embodiment Construction
[0020] Embodiments described herein provide a semiconductor package substrate and / or substrate with additional metal lines disposed between input / output (I / O) pads or around input / output (I / O) pads. Pad for solder bridging stop. The layout can be implemented directly on the semiconductor package substrate and / or substrate with no anticipated additional variables or process costs other than a design change or implementation cost.
[0021] figure 1 Illustrated is a plan view of an embodiment of a substrate 100, such as a printed circuit board (PCB), for mechanically supporting electronic components and electrically connecting the electronic components using conductive traces 102 and pads 104, the conductive traces 102 and solder pads 104. The disk 104 is etched or otherwise patterned from one or more metal (eg, copper) foils laminated on a non-conductive substrate 106 . Substrate 100 may be single-sided (eg, one copper layer), double-sided (eg, two copper layers), or multi-lay...
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The present invention relates to solder bridging stop structures for circuit substrates and semiconductor packages. Provided is a substrate for mechanically supporting and electrically connecting electronic components comprising: a non-conductive substrate, a plurality of conductive traces and pads disposed on the non-conductive substrate, and coated on the non-conductive substrate and covering traces to the solder mask. Metal lines are arranged on the non-conductive substrate under the solder mask and along at least two sides of the pads arranged in corners of the non-conductive substrate such that the metal lines are inserted in the corners of the non-conductive substrate between the pad and each adjacent pad. The metal lines form raised areas in the solder mask along the metal lines that prevent solder bridging in the corners of the non-conductive substrate during solder reflow. Corresponding semiconductor packages and semiconductor assemblies having the solder bridging prevention structure are also provided.
Description
technical field [0001] The present application relates to circuit substrates and semiconductor packages, and more particularly to preventing solder bridging on circuit substrates and semiconductor packages. Background technique [0002] Solder bridging is an unintended electrical connection between two conductors through a drop of solder. In semiconductor package and substrate assemblies, solder bridging between semiconductor package and substrate solder joints is a big problem. Bending of the semiconductor package and / or substrate increases the risk of solder bridging of the die-to-package or package-to-die solder joints. In general, the farther away from the neutral point (ie, the center of the package), the greater the curvature. Therefore, the risk of solder bridging in corner area land pads or in corner solder joints is greatest. Traditional methods used to avoid solder bridging involve optimization of package and substrate design, and package and substrate bill of m...
Claims
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IPC IPC(8): H01L23/488H01L23/495
CPCH05K1/111H05K3/3436H05K3/3452H05K2201/09045H05K2201/09909H05K2201/10734
Inventor C·B·玛贝拉F·施诺伊
Owner INFINEON TECH AG